SLLSEB1D February   2012  – November 2015 TPD1E10B06

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

MIN MAX UNIT
Operating temperature –40 125 °C
IPP Peak pulse current (tp = 8/20 µs) 6 A
PPP Peak pulse power (tp = 8/20 µs) 90 W
Tstg Storage temperature –65 155 °C

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
IEC 61000-4-2 Contact Discharge 30000
IEC 61000-4-2 Air-Gap Discharge 30000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Operating Free-Air Temperature, TA –40 125 °C
Operating Voltage Pin 1 to 2 or Pin 2 to 1 –5.5 5.5 V

6.4 Thermal Information

THERMAL METRIC(1) TPD1E10B06 UNIT
DPY (X1SON)
2 PINS
RθJA Junction-to-ambient thermal resistance 615.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 404.8 °C/W
RθJB Junction-to-board thermal resistance 493.3 °C/W
ψJT Junction-to-top characterization parameter 127.7 °C/W
ψJB Junction-to-board characterization parameter 493.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 162 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITION MIN TYP MAX UNIT
VRWM Reverse stand-off voltage Pin 1 to 2 or Pin 2 to 1 5.5 V
ILEAK Leakage current Pin 1 = 5 V, Pin 2 = 0 V 100 nA
VClamp1,2 Clamp voltage with ESD strike on pin 1, pin 2 grounded. IPP = 1 A, tp = 8 to 20 μs(2) 10 V
IPP = 5 A, tp = 8 to 20 μs(2) 14
VClamp2,1 Clamp voltage with ESD strike on pin 2, pin 1 grounded. IPP = 1 A, tp = 8 to 20 μs(2) 8.5 V
IPP = 5 A, tp = 8 to 20 μs(2) 14
RDYN Dynamic resistance Pin 1 to Pin 2(1) 0.32 Ω
Pin 2 to Pin 1(1) 0.38
CIO I/O capacitance VIO = 2.5 V; ƒ = 1 MHz 12 pF
VBR1,2 Break-down voltage, pin 1 to pin 2 IIO = 1 mA 6 V
VBR2,1 Break-down voltage, pin 2 to pin 1 IIO = 1 mA 6 V
(1) Extraction of RDYNAMIC using least squares fit of TLP characteristics between IPP = 10 A and IPP = 20 A.
(2) Nonrepetitive current pulse 8 to 20 µs exponentially decaying waveform according to IEC 61000-4-5

6.6 Typical Characteristics

TPD1E10B06 con8kv.gif
Figure 1. IEC 61000-4-2 Clamp Voltage +8-kV Contact ESD
TPD1E10B06 TLP12.gif
Figure 3. Transmission Line Pulse (TLP) Waveform Pin 1 to Pin 2
TPD1E10B06 IV.gif
Figure 5. IV Curve
TPD1E10B06 surge21.gif
Figure 7. Negative Surge Waveform 8 to 20 µs
TPD1E10B06 insertionloss.gif
Figure 9. Insertion Loss
TPD1E10B06 conm8kv.gif
Figure 2. IEC 61000-4-2 Clamp Voltage –8-kV Contact ESD
TPD1E10B06 TLP21.gif
Figure 4. Transmission Line Pulse (TLP) Waveform Pin 2 to Pin 1
TPD1E10B06 surge12.gif
Figure 6. Positive Surge Waveform 8 to 20 µs
TPD1E10B06 cap.gif
Figure 8. Pin Capacitance Across VBIAS