SLVSBO7N December   2012  – February 2022 TPD1E05U06 , TPD4E05U06 , TPD6E05U06

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1.     Absolute Maximum Ratings
    2. 6.1 ESD Ratings—JEDEC Specification
    3. 6.2 ESD Ratings—IEC Specification
    4.     Recommended Operating Conditions
    5. 6.3 Thermal Information
    6. 6.4 Electrical Characteristics
    7. 6.5 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 ±15-kV IEC61000-4-2 Level 4 ESD Protection
      2. 7.3.2 IEC61000-4-4 EFT Protection
      3. 7.3.3 IEC61000-4-5 Surge Protection
      4. 7.3.4 I/O Capacitance
      5. 7.3.5 DC Breakdown Voltage
      6. 7.3.6 Ultra-Low Leakage Current
      7. 7.3.7 Low ESD Clamping Voltage
      8. 7.3.8 Industrial Temperature Range
      9. 7.3.9 Easy Flow-Through Routing
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 HDMI 2.0 Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Signal Range on Pin 1, 2, 4, or 5
        3. 8.2.1.3 Application Curves
      2. 8.2.2 HDMI 2.0 Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Signal Range
          2. 8.2.2.2.2 Operating Frequency
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 TPD4E05U06 Layout Example
      2. 10.2.2 TPD1E05U06 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision M (January 2017) to Revision N (February 2022)

  • Updated the SOD-523 package information from the body size dimensions (0.8 mm × 1.2 mm) to the lead-to-lead dimensions (1.60 mm × 0.80 mm × 0.65 mm) Go

Changes from Revision L (January 2017) to Revision M (December 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated the Features section to include SOD-523 package informationGo
  • Added the DYA package to the Device Information tableGo
  • Added the DYA package to the Pin Configuration and Functions sectionGo
  • Changed the minimum DC breakdown voltage from 6 V to 6.5 V in the Detailed Description sectionGo
  • Changed the minimum reverse standoff voltage from 5 V to 5.5 V in the Detailed Description sectionGo
  • Updated the Related Documentation sectionGo

Changes from Revision K (November 2016) to Revision L (January 2017)

  • Updated DPY pinout image.Go
  • Updated title from TPD4E05U06 to TPD6E05U06 in Figure 7-3 Go

Changes from Revision J (March 2016) to Revision K (November 2016)

  • Changed min value of VBR from 6 V to 6.5 V in the Electrical Characteristics tableGo

Changes from Revision I (June 2015) to Revision J (March 2016)

  • Replaced all instances of X2SON with X1SON Go
  • Update the Pin Functions table Go
  • Added the Power Supply Recommendations sectionGo

Changes from Revision H (May 2015) to Revision I (June 2015)

  • Added trademarks Go
  • Corrected TPD6E05U06 Pin 13 nameGo
  • Corrected TLP definitionGo

Changes from Revision G (July 2014) to Revision H (May 2015)

  • Added additional applicationGo
  • Updated with HDMI 2.0 Eye DiagramsGo

Changes from Revision F (November 2013) to Revision G (July 2014)

  • Added 61000-4-4 EFT complianceGo
  • Added Thermal Information tableGo
  • Added Handling Ratings tableGo
  • Added the Detailed Description sectionGo
  • Added the Application and Implementation sectionGo
  • Added Layout section. Go

Changes from Revision * (December 2012) to Revision A (December 2012)

  • Added TPS2EUSB30A part to document.Go

Changes from Revision A (December 2012) to Revision B (January 2013)

  • Added Insertion Loss Graphic.Go
  • Added Eye Diagrams.Go

Changes from Revision B (January 2013) to Revision C (March 2013)

  • Changed IO Capacitance rangeGo
  • Changed test conditions and typ values for Vclamp Go
  • Added typ RDYN values for DQA and RVZ packagesGo
  • Added CL values for DQA and RVZ packagesGo
  • Changed CURRENT vs VOLTAGE graphicGo
  • Changed Insertion Loss graphicGo
  • Changed HDMI Eye DiagramsGo

Changes from Revision C (March 2013) to Revision D ()

  • Updated TitleGo
  • Removed Ordering Information table.Go

Changes from Revision D (August 2013) to Revision E (November 2013)

  • Updated document formatting.Go
  • Added additional applicationGo