SLVSDW8B September   2017  – December 2021 TPS22917

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
      1. 7.7.1 Typical Electrical Characteristics
      2. 7.7.2 Typical Switching Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Test Circuit and Timing Waveforms Diagrams
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 On and Off Control
      2. 9.3.2 Turn-On Time (tON) and Adjustable Slew Rate (CT)
      3. 9.3.3 Fall Time (tFALL) and Quick Output Discharge (QOD)
        1. 9.3.3.1 QOD When System Power is Removed
    4. 9.4 Full-Time Reverse Current Blocking
    5. 9.5 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Limiting Inrush Current
        2. 10.2.2.2 Application Curves
        3. 10.2.2.3 Setting Fall Time for Shutdown Power Sequencing
        4. 10.2.2.4 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.3 Thermal Considerations

The maximum IC junction temperature must be restricted to 125°C under normal operating conditions. To calculate the maximum allowable dissipation, PD(max) for a given output current and ambient temperature, use Equation 12:

Equation 12. GUID-B6C5DCF9-2E93-4C74-B4F2-7B549BE0EBD9-low.gif

where

  • PD(MAX) = maximum allowable power dissipation
  • TJ(MAX) = maximum allowable junction temperature (125°C for the TPS22917x)
  • TA = ambient temperature of the device
  • θJA = junction to air thermal impedance. Refer to the Thermal Information section. This parameter is highly dependent upon board layout.