SLVSDW8A September   2017  – February 2018 TPS22917

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
      1. 6.7.1 Typical Electrical Characteristics
      2. 6.7.2 Typical Switching Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuit and Timing Waveforms Diagrams
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 On and Off Control
      2. 8.3.2 Turn On Time (tON) and Adjustable Slew Rate (CT)
      3. 8.3.3 Fall Time (tFALL) and Quick Output Discharge (QOD)
        1. 8.3.3.1 QOD when System Power is Removed
    4. 8.4 Full-Time Reverse Current Blocking
    5. 8.5 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Limiting Inrush Current
        2. 9.2.2.2 Application Curves
        3. 9.2.2.3 Setting Fall Time for Shutdown Power Sequencing
        4. 9.2.2.4 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.2.1 Limiting Inrush Current

Use Equation 5 to find the maximum slew rate value to limit inrush current for a given capacitance:

Equation 5. (Slew Rate) = IRUSH ÷ CL

where

  • IINRUSH = maximum acceptable inrush current (mA)
  • CL = capacitance on VOUT (μF)
  • Slew Rate = Output Slew Rate during turn on (mV/μs)

Once the required slew rate shown in Equation 1 can be used to find the minimum CT capacitance

Equation 6. CT = SRON ÷ (Slew Rate)
Equation 7. CT = 1900 ÷ 3.2 = 594 pF

To ensure an inrush current of less than 150 mA, choose a CT value greater than 594 pF. An appropriate value should be placed on such that the IMAX and IPLS specifications of the device are not violated.