SLUSCM4B October   2017  – November 2018 TPS2372

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PG Power Good (Converter Enable) Pin Interface
      2. 7.3.2 CLSA and CLSB Classification, AUTCLS
      3. 7.3.3 DEN Detection and Enable
      4. 7.3.4 Internal Pass MOSFET and Inrush Delay Enable, IRSHDL_EN
      5. 7.3.5 TPH, TPL and BT PSE Type Indicators
      6. 7.3.6 AMPS_CTL, MPS_DUTY and Automatic MPS
      7. 7.3.7 VDD Supply Voltage
      8. 7.3.8 VSS
      9. 7.3.9 Exposed Thermal PAD
    4. 7.4 Device Functional Modes
      1. 7.4.1  PoE Overview
      2. 7.4.2  Threshold Voltages
      3. 7.4.3  PoE Startup Sequence
      4. 7.4.4  Detection
      5. 7.4.5  Hardware Classification
      6. 7.4.6  Autoclass
      7. 7.4.7  Inrush and Startup
      8. 7.4.8  Maintain Power Signature
      9. 7.4.9  Startup and Converter Operation
      10. 7.4.10 PD Hotswap Operation
      11. 7.4.11 Startup and Power Management, PG and TPH, TPL, BT
      12. 7.4.12 Using DEN to Disable PoE
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Requirements
        1. 8.2.2.1  Input Bridges and Schottky Diodes
        2. 8.2.2.2  Protection, D1
        3. 8.2.2.3  Capacitor, C1
        4. 8.2.2.4  Detection Resistor, RDEN
        5. 8.2.2.5  Classification Resistors, RCLSA and RCLSB
        6. 8.2.2.6  Opto-isolators for TPH, TPL and BT
        7. 8.2.2.7  Automatic MPS and MPS Duty Cycle, RMPS and RMPS_DUTY
        8. 8.2.2.8  Internal Voltage Reference, RREF
        9. 8.2.2.9  Autoclass
        10. 8.2.2.10 Inrush Delay
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 EMI Containment
    4. 10.4 Thermal Considerations and OTSD
    5. 10.5 ESD
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Links
      2. 11.1.2 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (February 2018) to B Revision

Changes from * Revision (October 2017) to A Revision

  • Changed TPS2372-2 typical current limit to 1.85 AGo
  • Changed TPS2372-3 device to production dataGo
  • Deleted advance information table notesGo
  • Changed current limit nominal value to 1.85 and maximum value to 2.2Go
  • Changed minimum value of inrush termination to 65%Go
  • Changed typical shutdown temperature to 158°CGo
  • Added TPS2372-4 to the title of Figure 10Go
  • Changed "current limit is changed to 1.8 A" to "current limit is changed to 1.85 A" in Internal Pass MOSFET and Inrush Delay Enable, IRSHDL_EN subsectionGo
  • Changed "~" to "approximately" and "1.8 A" to "1.85 A" in the Advanced Startup and Converter Operation subsectionStartup and Converter Operation subsectionGo
  • Changed equation 3 and equation 4 values in Automatic MPS and MPS Duty Cycle, RMPS and RMPS_DUTYGo
  • Changed TPS2372-3RGWR and TPS2372-3RGWT devices to ACTIVEGo