SLVSCL5A June   2014  – November 2020 TPS2559

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Thermal Sense
      2. 8.3.2 Overcurrent Protection
      3. 8.3.3 FAULT Response
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation with VIN Undervoltage Lockout (UVLO) Control
      2. 8.4.2 Operation with EN Control
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Step-by-Step Design Procedure
        2. 9.2.2.2 Input and Output Capacitance
        3. 9.2.2.3 Programming the Current-Limit Threshold
        4. 9.2.2.4 Design Above a Minimum Current Limit
        5. 9.2.2.5 Design Below a Maximum Current Limit
        6. 9.2.2.6 Accounting for Resistor Tolerance
        7. 9.2.2.7 Power Dissipation and Junction Temperature
        8. 9.2.2.8 Auto-Retry
        9. 9.2.2.9 Two-Level Current-Limit
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

  • Place the 100-nF bypass capacitor near the IN and GND pins, and make the connections using a low-inductance trace.
  • Placing a high-value electrolytic capacitor and a 100-nF bypass capacitor on the output pin is recommended when large transient currents are expected on the output.
  • The traces routing the RILIM resistor to the device should be as short as possible to reduce parasitic effects on the current limit accuracy.
  • The PowerPAD should be directly connected to PCB ground plane using wide and short copper trace.