SLVSCL5A June   2014  – November 2020 TPS2559

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Thermal Sense
      2. 8.3.2 Overcurrent Protection
      3. 8.3.3 FAULT Response
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation with VIN Undervoltage Lockout (UVLO) Control
      2. 8.4.2 Operation with EN Control
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Step-by-Step Design Procedure
        2. 9.2.2.2 Input and Output Capacitance
        3. 9.2.2.3 Programming the Current-Limit Threshold
        4. 9.2.2.4 Design Above a Minimum Current Limit
        5. 9.2.2.5 Design Below a Maximum Current Limit
        6. 9.2.2.6 Accounting for Resistor Tolerance
        7. 9.2.2.7 Power Dissipation and Junction Temperature
        8. 9.2.2.8 Auto-Retry
        9. 9.2.2.9 Two-Level Current-Limit
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Electrical Characteristics

conditions are –40°C ≤ TJ ≤ 125°C, 2.5 V ≤ VIN ≤ 6.5 V, V(EN) = VIN, R(ILIM) = 49.9kΩ; positive current are into pins; typical value is at 25°C; all voltages are with respect to GND (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SWITCH
RDS(on) Input/output resistance(1) TJ = 25°C 13 16 mΩ
-40°C ≤ TJ ≤ 125°C 21
ENABLE INPUT EN
EN turn-on/off threshold 0.66 1.1 V
Hysteresis 55(2) mV
I(EN) Input current V(EN) = 0 V or V(EN) = 6.5 V –1 1 µA
CURRENT LIMIT
IOS OUT short-circuit current limit R(ILIM) = 24.9 kΩ 4490 4731 4900 mA
R(ILIM) = 44.2 kΩ 2505 2665 2775
R(ILIM) = 49.9 kΩ 2215 2360 2460
R(ILIM) = 61.9 kΩ 1780 1902 1990
R(ILIM) = 100 kΩ 1080 1176 1245
ILIM pin short to GND (R(ILIM) = 0) 5860 6650 7460
SUPPLY CURRENT
I(IN_OFF) Disabled, IN supply current V(EN) = 0 V, no load on OUT 0.1 2 µA
I(IN_ON) Enabled, IN supply current R(ILIM) = 100 kΩ, no load on OUT 97 125 µA
R(ILIM) = 24.9 kΩ, no load on OUT 107 135
I(REV) Reverse leakage current VOUT = 6.5 V, VIN = 0 V, TJ = 25°C,
measure IOUT		 0.01 1 µA
UNDERVOLTAGE LOCKOUT (UVLO)
VUVLO IN rising UVLO threshold voltage 2.36 2.45 V
Hysteresis 35(2) mV
FAULT
VOL Output low voltage IFAULT = 1 mA 180 mV
Off-state leakage VFAULT = 6.5 V 1 µA
THERMAL SHUTDOWN
OTSD2 Thermal shutdown threshold 155 °C
OTSD1 Thermal shutdown threshold in current-limit 135
Hysteresis 20 (2)
(1) Pulse-testing techniques maintain junction temperature close to ambient temperature. Thermal effects must be taken into account separately.
(2) These parameters are provided for reference only, and do not constitute part of TI’s published device specifications for purposes of TI’s product warranty.