SNVSCN9C September   2024  – August 2025 TPS3423 , TPS3424

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Inputs
        1. 7.3.1.1 Push-Button Input (PB)
        2. 7.3.1.2 Push-Button Timing Programmability
        3. 7.3.1.3 KILL
      2. 7.3.2 Outputs
        1. 7.3.2.1 Interrupt (INT)
        2. 7.3.2.2 RESET / RESET
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Power Button Control with TPS3424
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 PB and RESET Topology
          2. 8.2.1.2.2 Short Press Time (tSP) and Long Press Time (tLP) selection
          3. 8.2.1.2.3 Interrupt and Kill Feature
        3. 8.2.1.3 Application Curve
      2. 8.2.2 High Voltage Connection
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS3423 / TPS3424 UNIT
DRL (SOT-583)
8 PINS
RθJA Junction-to-ambient thermal resistance 122.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 68.1 °C/W
RθJB Junction-to-board thermal resistance 31.1 °C/W
ΨJT Junction-to-top characterization parameter 2.6 °C/W
ΨJB Junction-to-board characterization parameter 30.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance NA °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.