SLVS228D August   1999  – December 2020

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Device Comparison
  6. 6Pin Configuration and Functions
  7. 7Specifications
    1. 7.1 Absolute Maximum Ratings (1) (1)
    2. 7.2 Recommended Operating Conditions
    3. 7.3 Dissipation Ratings
    4. 7.4 Electrical Characteristics
    5. 7.5 Timing Requirements
    6. 7.6 Switching Characteristics
    7. 7.7 Timing Diagram
    8. 7.8 Typical Characteristics
  8. 8Detailed Description
  9. 9Electrostatic Discharge Caution

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.