SNVSBT6C July   2021  – December 2022 TPS38700-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Device State Diagram
      2. 8.3.2 Built-In Self Test and Configuration Load
      3. 8.3.3 CLK32K
      4. 8.3.4 BACKUP State
      5. 8.3.5 FAILSAFE State
      6. 8.3.6 Transitioning Sequences
        1. 8.3.6.1 Sequence 1: Power Up
        2. 8.3.6.2 Sequence 2: Emergency Power Down
        3. 8.3.6.3 Sequence 3: Sleep Entry
        4. 8.3.6.4 Sequence 4: Sleep Exit
        5. 8.3.6.5 Sequence 5 & 6: Power Down from Active and Sleep States
        6. 8.3.6.6 Sequence 7: Sleep Exit Due to NRST_IN
        7. 8.3.6.7 Sequence 8: RESET Due to NRST_IN
        8. 8.3.6.8 Sequence 9: Failsafe Power Down
        9. 8.3.6.9 Output Sequencing
      7. 8.3.7 I2C
    4. 8.4 Register Map Table
      1. 8.4.1 Register Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Automotive Multichannel Sequencer and Monitor
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Guidelines
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
      1.      Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.5 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.