SLVSDF5D September   2017  – October 2019 TPS50601A-SP

PRODUCTION DATA.  

  1. 1 Features
    1.     Efficiency at VIN = PVIN = 5 V
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  VIN and Power VIN Pins (VIN and PVIN)
      2. 7.3.2  Voltage Reference
      3. 7.3.3  Adjusting the Output Voltage
      4. 7.3.4  Safe Start-Up Into Prebiased Outputs
      5. 7.3.5  Error Amplifier
      6. 7.3.6  Slope Compensation
      7. 7.3.7  Enable and Adjust UVLO
      8. 7.3.8  Adjustable Switching Frequency and Synchronization (SYNC)
      9. 7.3.9  Slow Start (SS/TR)
      10. 7.3.10 Power Good (PWRGD)
      11. 7.3.11 Sequencing (SS/TR)
      12. 7.3.12 Output Overvoltage Protection (OVP)
      13. 7.3.13 Overcurrent Protection
        1. 7.3.13.1 High-Side MOSFET Overcurrent Protection
        2. 7.3.13.2 Low-Side MOSFET Overcurrent Protection
      14. 7.3.14 Thermal Shutdown
      15. 7.3.15 Turn-On Behavior
      16. 7.3.16 Small Signal Model for Frequency Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Fixed-Frequency PWM Control
      2. 7.4.2 Continuous Current Mode (CCM) Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Operating Frequency
        2. 8.2.2.2 Output Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Slow Start Capacitor Selection
        5. 8.2.2.5 Undervoltage Lockout (UVLO) Set Point
        6. 8.2.2.6 Output Voltage Feedback Resistor Selection
        7. 8.2.2.7 Compensation Component Selection
      3. 8.2.3 Parallel Operation
      4. 8.2.4 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (August 2018) to D Revision

  • added note: Weight = 1.22g to the Device Information tableGo
  • Changed the Pin Configuration imageGo
  • Changed SYNC out high level threshold MIN value From: 2 V To: VIN - 0.3 in the Electrical Characteristics tableGo
  • Deleted test Condition "Percent of program frequency" from SYNC in frequency range in the Electrical Characteristics tableGo
  • Changed "180° out of phase to the internal 500-kHz switching frequency." To: "180° in phase to the internal 500-kHz switching frequency." in the Description of Table 3Go
  • Changed "180° out of phase respect to the internal oscillator.." To: "180° in phase respect to the internal oscillator.." in the Parallel Operation sectionGo
  • Changed "(180° out of phase respect to the master device)." To: "(180° in phase respect to the master device).." in the Parallel Operation sectionGo

Changes from B Revision (June 2018) to C Revision

  • Replaced all coordinates in Bond Pad Coordinates in Microns table with corrected valuesGo

Changes from A Revision (March 2018) to B Revision

  • Added Bare Die Information tableGo
  • Added Bond Pad Coordinates in Microns tableGo

Changes from * Revision (September 2017) to A Revision

  • Changed the device status from Advance Information to Production DataGo