SLUSEE8 September   2022 TPS51383

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  PWM Operation and D-CAP3 Control Mode
      2. 7.3.2  VCC LDO
      3. 7.3.3  Soft Start
      4. 7.3.4  Enable Control
      5. 7.3.5  Power Good
      6. 7.3.6  Overcurrent Protection and Undervoltage Protection
      7. 7.3.7  100-mA LDO with Switch Over
      8. 7.3.8  UVLO Protection
      9. 7.3.9  Overvoltage Protection
      10. 7.3.10 Output Voltage Discharge
      11. 7.3.11 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 MODE Pin
      2. 7.4.2 Out-Of-Audio™ Mode
      3. 7.4.3 Power Save Mode (PSM)
  8. 8  Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Component Selection
          1. 8.2.2.1.1 Inductor Selection
          2. 8.2.2.1.2 Output Capacitor Selection
          3. 8.2.2.1.3 Input Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) DEVICE UNIT
RJNR (QFN, JEDEC) RJNR (QFN, TI EVM)
12 PINS 12 PINS
RθJA Junction-to-ambient thermal resistance 72.7 37.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.1 Not Applicable (2) °C/W
RθJB Junction-to-board thermal resistance 18.7 Not Applicable (2) °C/W
ψJT Junction-to-top characterization parameter 1.8 3.7 °C/W
ψJB Junction-to-board characterization parameter 18.4 18.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The thermal simulation setup is not applicable to a TI EVM layout.