SLUSAE5G August   2011  – April 2021 TPS53355

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings (1)
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Infomation
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 5-V LDO and VREG Start-Up
      2. 7.3.2 Adaptive On-Time D-CAP Control and Frequency Selection
      3. 7.3.3 Ramp Signal
      4. 7.3.4 Adaptive Zero Crossing
      5. 7.3.5 Power-Good
      6. 7.3.6 Current Sense, Overcurrent and Short Circuit Protection
      7. 7.3.7 Overvoltage and Undervoltage Protection
      8. 7.3.8 UVLO Protection
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable, Soft Start, and Mode Selection
      2. 7.4.2 Auto-Skip Eco-mode™ Light Load Operation
      3. 7.4.3 Forced Continuous Conduction Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Small Signal Model
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application Circuit Diagram with Ceramic Output Capacitors
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 External Component Selection
          3. 8.2.1.2.3 External Component Selection Using All Ceramic Output Capacitors
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application Circuit
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 External Component Selection
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQP|22
Thermal pad, mechanical data (Package|Pins)
Orderable Information
8.2.1.2.2 External Component Selection

The external components selection is a simple process when using organic semiconductors or special polymer output capacitors.

  1. Select Operation Mode and Soft-Start Time

    Select operation mode and soft-start time using Table 7-3.

  2. Select Switching Frequency

    Select the switching frequency from 250 kHz to 1 MHz using Table 7-1.

  3. Choose the Inductor

    The inductance value should be determined to give the ripple current of approximately 1/4 to 1/2 of maximum output current. Larger ripple current increases output ripple voltage and improves signal-to-noise ratio and helps ensure stable operation, but increases inductor core loss. Using 1/3 ripple current to maximum output current ratio, the inductance can be determined by Equation 8.

    Equation 8. GUID-7E551C0E-A525-41CF-B36F-C28CF71C78D4-low.gif

    The inductor requires a low DCR to achieve good efficiency. It also requires enough room above peak inductor current before saturation. The peak inductor current can be estimated in Equation 9.

    Equation 9. GUID-FE7E353D-EF71-4B72-8591-4A3C0C29106E-low.gif
  4. External Component Selection with All Ceramic Output Capacitors

    Refer to Section 8.2.1.2.3 to select external components because ceramic output capacitors are used in this design.

  5. Choose the Overcurrent Setting Resistor

    The overcurrent setting resistor, RTRIP, can be determined by Equation 10.

    Equation 10. GUID-35491B50-EB90-4F7D-A163-D73A5786C484-low.gif

    where

    • ITRIP is the TRIP pin sourcing current (10 µA)
    • RDS(on) is the thermally compensated on-time resistance value of the low-side MOSFET

    Use an RDS(on) value of 1.5 mΩ for an overcurrent level of approximately 30 A. Use an RDS(on) value of 1.7 mΩ for overcurrent level of approximately 10 A.

  6. BST Resistor Selection

    The recommended BST resistor value is 2 Ω and anything larger than 5.1 Ω is not recommended. Note that when the gate drive turns on, the voltage on the boot-strap capacitor splits between the internal pull-up resistance and the boot-strap resistance, with the internal circuits only seeing the portion across the internal pull-up resistance. Therefore, when the external resistor gets larger than the pull-up resistance, it crashes the head-room of the SW to BOOT logic, which can cause logic issues with the high-side gate driver.