SLVS839F July   2008  – October 2014 TPS54331

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Simplified Schematic
    1.     TPS54331 (D Package) Efficiency
  5. Revision History
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed-Frequency PWM Control
      2. 8.3.2  Voltage Reference (Vref)
      3. 8.3.3  Bootstrap Voltage (BOOT)
      4. 8.3.4  Enable and Adjustable Input Undervoltage Lockout (VIN UVLO)
      5. 8.3.5  Programmable Slow Start Using SS Pin
      6. 8.3.6  Error Amplifier
      7. 8.3.7  Slope Compensation
      8. 8.3.8  Current-Mode Compensation Design
      9. 8.3.9  Overcurrent Protection and Frequency Shift
      10. 8.3.10 Overvoltage Transient Protection
      11. 8.3.11 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Eco-mode™
      2. 8.4.2 Operation With VIN < 3.5 V
      3. 8.4.3 Operation With EN Control
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Custom Design with WEBENCH Tools
        2. 9.2.2.2  Switching Frequency
        3. 9.2.2.3  Output Voltage Set Point
        4. 9.2.2.4  Input Capacitors
        5. 9.2.2.5  Output Filter Components
          1. 9.2.2.5.1 Inductor Selection
        6. 9.2.2.6  Capacitor Selection
        7. 9.2.2.7  Compensation Components
        8. 9.2.2.8  Bootstrap Capacitor
        9. 9.2.2.9  Catch Diode
        10. 9.2.2.10 Output Voltage Limitations
        11. 9.2.2.11 Power Dissipation Estimate
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Electromagnetic Interference (EMI) Considerations
  12. 12Device and Documentation Support
    1. 12.1 Custom Design with WEBENCH Tools
    2. 12.2 Device Support
      1. 12.2.1 Development Support
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Current-Mode Compensation Design

To simplify design efforts using the TPS54331 device, the typical designs for common applications are listed in Table 1. For designs using ceramic output capacitors, proper derating of ceramic output capacitance is recommended when performing the stability analysis because the actual ceramic capacitance drops considerably from the nominal value when the applied voltage increases. See the Detailed Design Procedure section for the detailed guidelines or use the WEBENCH Software tool (www.TI.com/WEBENCH).

Table 1. Typical Designs (Refer to the Simplified Schematic)

VIN
(V)
VOUT
(V)
ƒSW
(kHz)
Lo
(μH)
Co
RO1
(kΩ)
RO2
(kΩ)
C2
(pF)
C1
(pF)
R3
(kΩ)
12 5 570 6.8 Ceramic 33 μF, ×2 10 1.91 39 4700 49.9
12 3.3 570 6.8 Ceramic 47μF, ×2 10 3.24 47 1000 29.4
12 1.8 570 4.7 Ceramic 100 μF 10 8.06 68 5600 29.4
12 0.9 570 3.3 Ceramic 100 μF, ×2 10 80.6 56 5600 29.4
12 5 570 6.8 Aluminum 330 μF, 160 mΩ 10 1.91 68 120 29.4
12 3.3 570 6.8 Aluminum 470 μF, 160 mΩ 10 3.24 82 220 10
12 1.8 570 4.7 SP 100 μF, 15 mΩ 10 8.06 68 5600 29.4
12 0.9 570 3.3 SP 330 μF, 12 mΩ 10 80.6 100 1200 49.9