SLVSBI5A May   2013  – October 2014 TPS54531

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Simplified Schematic
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed-Frequency PWM Control
      2. 8.3.2  Voltage Reference (Vref)
      3. 8.3.3  Bootstrap Voltage (BOOT)
      4. 8.3.4  Enable and Adjustable Input Undervoltage Lockout (VIN UVLO)
      5. 8.3.5  Programmable Slow Start Using SS Pin
      6. 8.3.6  Error Amplifier
      7. 8.3.7  Slope Compensation
      8. 8.3.8  Current-Mode Compensation Design
      9. 8.3.9  Overcurrent Protection and Frequency Shift
      10. 8.3.10 Overvoltage Transient Protection
      11. 8.3.11 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Eco-mode™
      2. 8.4.2 Operation With VIN < 3.5 V
      3. 8.4.3 Operation With EN Control
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Switching Frequency
        2. 9.2.2.2  Output Voltage Set Point
        3. 9.2.2.3  Undervoltage Lockout Set Point
        4. 9.2.2.4  Input Capacitors
        5. 9.2.2.5  Output Filter Components
          1. 9.2.2.5.1 Inductor Selection
          2. 9.2.2.5.2 Capacitor Selection
        6. 9.2.2.6  Compensation Components
        7. 9.2.2.7  Bootstrap Capacitor
        8. 9.2.2.8  Catch Diode
        9. 9.2.2.9  Slow-Start Capacitor
        10. 9.2.2.10 Output Voltage Limitations
        11. 9.2.2.11 Power Dissipation Estimate
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Electromagnetic Interference (EMI) Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Development Support

For the WEBENCH Software Tool, go to www.TI.com/WEBENCH.

12.2 Trademarks

Eco-mode, PowerPAD are trademarks of Texas Instruments.

WEBENCH is a registered trademark of TI.

All other trademarks are the property of their respective owners.

12.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.4 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.