SLUSC70D March 2016 – July 2017 TPS548D22
PRODUCTION DATA.
Proper mounting technique adequately covers the exposed thermal tab with solder. Excessive heat during the reflow process can affect electrical performance. Figure 32 shows the recommended reflow oven thermal profile. Proper post-assembly cleaning is also critical to device performance. See the Application Report, QFN/SON PCB Attachment, (SLUA271) for more information.
PARAMETER | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|
RAMP UP AND RAMP DOWN | |||||
rRAMP(up) | Average ramp-up rate, TS(max) to TP | 3 | °C/s | ||
rRAMP(down) | Average ramp-down rate, TP to TS(max) | 6 | °C/s | ||
PRE-HEAT | |||||
TS | Pre-heat temperature | 150 | 200 | °C | |
tS | Pre-heat time, TS(min) to TS(max) | 60 | 180 | s | |
REFLOW | |||||
TL | Liquidus temperature | 217 | °C | ||
TP | Peak temperature | 260 | °C | ||
tL | Time maintained above liquidus temperature, TL | 60 | 150 | s | |
tP | Time maintained within 5°C of peak temperature, TP | 20 | 40 | s | |
t25P | Total time from 25°C to peak temperature, TP | 480 | s |