SLUSDX1 September   2020 TPS563211

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Advanced Emulated Current Mode Control
      2. 7.3.2 Mode Selection and PG/SS Pin Function Configuration
      3. 7.3.3 Power Good (PG)
      4. 7.3.4 Soft Start and Pre-Biased Soft Start
      5. 7.3.5 Output Discharge through PG/SS Pin
      6. 7.3.6 Precise Enable and Adjusting Undervoltage Lockout
      7. 7.3.7 Overcurrent limit and Undervoltage Protection
      8. 7.3.8 Overvoltage Protection
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 CCM Operation
      4. 7.4.4 FCCM Operation
      5. 7.4.5 DCM Operation and Eco-mode Operation
      6. 7.4.6 On-time Extension for Large Duty Cycle Operation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Resistors Selection
        3. 8.2.2.3 Output Inductor Selection
        4. 8.2.2.4 Output Capacitor Selection
        5. 8.2.2.5 Input Capacitor Selection
        6. 8.2.2.6 Bootstrap Capacitor Selection
        7. 8.2.2.7 Undervoltage Lockout Set Point
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information

THERMAL METRIC(1) TPS563211 UNIT
DRL (SOT583)
8 PINS
RθJA (2) Junction-to-ambient thermal resistance 116.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 41.7 °C/W
RθJB Junction-to-board thermal resistance 20.9 °C/W
ΨJT Junction-to-top characterization parameter 1.0 °C/W
ΨJB Junction-to-board characterization parameter 20.8 °C/W
RθJA(EVM) (3) Junction-to-ambient thermal resistance on TPS563211EVM 70 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953
The value of RθJA given in this table is only valid for comparison with other packages and can not be used for design purposes. These values were simulated on a standard JEDEC board. They do not represent the performance obtained in an actual application.
The real RθJA  on the TPS563211EVM is about 70 ℃/W, test condition: VIN = 12 V, VOUT = 5 V, IOUT = 3 A, T= 25 ℃.