SLUSEH9 October   2021 TPS563212

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Advanced Emulated Current Mode Control
      2. 7.3.2 Mode Selection and PG/SS Pin Function Configuration
      3. 7.3.3 Power Good (PG)
      4. 7.3.4 Soft Start and Pre-Biased Soft Start
      5. 7.3.5 Output Discharge Through PG/SS Pin
      6. 7.3.6 Precise Enable and Adjusting Undervoltage Lockout
      7. 7.3.7 Overcurrent Limit and Undervoltage Protection
      8. 7.3.8 Overvoltage Protection
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 FCCM Operation
      4. 7.4.4 CCM Operation
      5. 7.4.5 DCM Operation and Eco-mode Operation
      6. 7.4.6 On-Time Extension for Large Duty Cycle Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Resistors Selection
        3. 8.2.2.3 Output Inductor Selection
        4. 8.2.2.4 Output Capacitor Selection
        5. 8.2.2.5 Input Capacitor Selection
        6. 8.2.2.6 Bootstrap Capacitor Selection
        7. 8.2.2.7 Undervoltage Lockout Set Point
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

Limits apply over the recommended operating junction temperature (TJ ) range of –40°C to +125°C, unless otherwise stated. Minimum and maximum limits are specified through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated, the following conditions apply: VIN = 4.2 V to 18 V.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
SUPPLY
VINOperation input voltage4.218V
IQ(VIN)VIN quiescent current at power save modeNonswitching, VEN = 1.2 V, VFB = 0.65 V, IOUT = 0 mA120µA
VIN quiescent current at FCCMNonswitching, VEN = 1.2 V, VFB = 0.65 V, IOUT = 0 mA450µA
ISD(VIN)VIN shutdown supply currentVIN = 12 V, VEN = 0 V310µA
UVLO
VUVLO(R)VIN UVLO rising thresholdVIN rising3.844.2V
VUVLO(F)VIN UVLO falling thresholdVIN falling3.43.63.8V
ENABLE
VEN(R)EN voltage rising thresholdEN rising, enable switching1.051.151.25V
VEN(F)EN voltage falling thresholdEN falling, disable switching0.911.011.10V
IEN(P1)EN pin sourcing current pre-EN rising thresholdVEN = 1.0 V0.931.21.5µA
IEN(H)EN pin sourcing current hysteresis2.43.13.81µA
REFERENCE VOLTAGE
VFBFB voltageTJ = 25°C0.5940.60.606V
TJ = –40°C to 125°C, VIN = 12 V0.5910.60.609V
IFB(LKG)FB input leakage currentVFB = 0.65 V, TJ = 25°C–0.100.1µA
START-UP
ISSSoft-start charge currentVSS = 0 V4.56.68.3µA
tSSInternal fixed soft-start timeFrom first switching pulse until target VOUT1.522.6ms
SWITCHING FREQUENCY
fSW(FCCM)Switching frequency, FCCM operation110012001300kHz
POWER STAGE
RDSON(HS)High-side MOSFET on-resistanceTJ = 25°C, VIN = 12 V, VBOOT-SW = 5 V66mΩ
RDSON(LS)Low-side MOSFET on-resistanceTJ = 25°C, VIN = 12 V33mΩ
tON(min)(1)Minimum ON pulse width45ns
tON(max)Maximum ON pulse width6µs
tOFF(min)Minimum OFF pulse width105ns
OVERCURRENT PROTECTION
IHS(OC)High-side peak current limitPeak current limit on HS MOSFET4.2555.75A
ILS(OC)Low-side valley current limitValley current limit on LS MOSFET, VIN = 12 V3.044.9A
ILS(NOC)Low-side negative current limit for FCCMSinking current limit on LS MOSFET, VIN = 12 V1.11.52.2A
tHIC(WAIT)Wait time before entering Hiccup108µs
tHIC(RE)Hiccup time before re-start6Cycles
OUTPUT OVP AND UVP
VUVPUndervoltage-protection (UVP) threshold voltageVFB falling62.5%
UVP hysteresis5%
VOVPOvervoltage-protection (OVP) threshold voltageVFB rising107%112%114%
OVP hysteresis5%
POWER GOOD
VPGTHPower-good thresholdFB falling, PG from high to low82%87%92%
FB rising, PG from low to high87%92%97%
FB falling, PG from low to high101%107%112%
FB rising, PG from high to low107%112%114%
VPG(OL)PG pin output low-level voltageIPG = 0.6 mA0.3V
IPG(LKG)PG pin leakage current when open drain output is highVPG = 5.5 V–11µA
tPG(R)PG delay going from low to high112µs
tPG(F)PG delay going from high to low48µs
Minimum VIN for valid output(1) VPG/SS < 0.5 V at 100 μA 22.5V
THERMAL SHUTDOWN
TJ(SD)(1)Thermal shutdown threshold150°C
TJ(HYS)(1)Thermal shutdown hysteresis20°C
(1) Not production tested