SLVS644E February   2006  – December 2014 TPS61080 , TPS61081

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 5-V To 12-V, 250-mA Step-Up DC-DC Converter
  5. 5 Revision History
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Start Up
      2. 9.3.2 Overcurrent and Short Circuit Protection
      3. 9.3.3 Overvoltage Protection
      4. 9.3.4 Undervoltage Lockout (UVLO)
      5. 9.3.5 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Enable
      2. 9.4.2 Frequency Selection
      3. 9.4.3 Maximum and Minimum Output Current
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Program Output Voltage
      2. 10.1.2 Feed Forward Capacitor
      3. 10.1.3 Soft Start Capacitor
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Inductor Selection
        2. 10.2.2.2 Input And Output Capacitor Selection
      3. 10.2.3 Application Curves
    3. 10.3 System Examples
      1. 10.3.1 Torch Light and Flash Light
      2. 10.3.2 24Vout Output Converter
      3. 10.3.3 30 WLEDs Driver in Media Factor Form Display
        1. 10.3.3.1 ±15 V Dual Output Converter
        2. 10.3.3.2 Step-Up DC-DC Converter with Output Doubler
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Related Links
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply Voltages on pin VIN(2) –0.3 7 V
Voltages on pins EN, FB, SS, L and FSW(2) –0.3 7 V
Voltage on pin OUT(2) 30V V
Voltage on pin SW(2) 30V V
Continuous Power Dissipation See Thermal Information
Operating Junction Temperature Range –40 150 °C
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.

8.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Input voltage range 2.5 6.0 V
VOUT Output voltage range VIN 27 V
L Inductor(1) 4.7 10 μH
CIN Input capacitor(1) 1 μF
COUT Output capacitor(1) 4.7 30 μF
TA Operating ambient temperature –40 85 °C
TJ Operating junction temperature –40 125 °C
(1) Refer to Application and Implementation for further information

8.4 Thermal Information

THERMAL METRIC(1) TPS6108x UNIT
DRC
10 PINS
RθJA Junction-to-ambient thermal resistance 45.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 52.2
RθJB Junction-to-board thermal resistance 20.9
ψJT Junction-to-top characterization parameter 0.9
ψJB Junction-to-board characterization parameter 20.7
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

8.5 Electrical Characteristics

VIN = 3.6 V, EN = VIN, TA = –40°C to 85°C, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
VIN Input voltage range 2.5 6.0 V
IQ Operating quiescent current into VIN Device switching no load 6 mA
ISD Shutdown current EN = GND 1 μA
VUVLO Undervoltage lockout threshold VIN falling 1.65 1.8 V
Vhys Undervoltage lockout hysterisis 50 mV
ENABLE
VEN Enable level voltage VIN = 2.5 V to 6 V 1.2 V
Disable level voltage VIN = 2.5 V to 6 V 0.4
Ren Enable pulldown resistor 400 800 1600 kΩ
toff EN pulse width to disable EN high to low 74 ms
SOFT START
Iss Soft start bias current TA = 25°C 4.75 5 5.25 μA
4.6 5 5.4
Vclp SS pin to FB pin accuracy VSS = 500 mV 487 500 513 mV
FEEDBACK FB
IFB Feedback input bias current VFB = 1.229 V –100 100 nA
VFB Feedback regulation voltage 1.204 1.229 1.254 V
POWER SWITCH AND DIODE
RDS(ON) Isolation MOSFET on-resistance 0.06 0.1 Ω
N-channel MOSFET on-resistance VIN = VGS = 3.6 V 0.17 0.22 Ω
VIN = VGS = 2.5 V 0.2 0.32
ILN_NFET N-channel leakage current VDS = 28 V 1 2 μA
VF Power diode forward voltage Id = 1 A 0.85 1 V
ILN_ISO Isolation FET leakage current L pin to ground 1 μA
OC AND SC
ILIM N-Channel MOSFET current limit(1) TPS61080, FSW = High or FSW = Low 0.5 0.7 1.0 A
TPS61081, FSW = High or FSW = Low 1.3 1.6 2.0
ISC Short circuit current limit TPS61080 1.0 2.2 A
TPS61081 2.0 3.5
tscd Short circuit delay time 13 μs
tscr Short circuit release time 57 ms
VSC OUT short detection threshold (2) VIN – VOUT 1.4 V
OSCILLATOR
fS Oscillator frequency FSW pin high 1.0 1.2 1.5 MHz
FSW pin low 0.5 0.6 0.7
Dmax Maximum duty cycle FB = 1.0 V 90% 94%
Dmin Minimum duty cycle 5%
Rfsw FSW pin pulldown resistance 400 800 1600 kΩ
VFSW FSW high logic 1.6 V
FSW low logic 0.8
OVP
Vovp Output overvoltage protection VOUT rising 27 28 29 V
Output overvoltage protection hysteresis VOUT falling 0.7 V
THERMAL SHUTDOWN
Tshutdown Thermal shutdown threshold 160 °C
Thysteresis Thermal shutdown threshold hysteresis 15 °C
(1) VIN = 3.6 V, VOUT = 15 V, Duty cycle = 76%. See Figure 5 to Figure 8 for other operation conditions.
(2) OUT short circuit condition is detected if OUT stays lower than VIN – VSC for 1.7 ms after IC enables. See the Start Up section for details.

8.6 Typical Characteristics

Table 1. Table Of Graphs

FIGURE
Efficiency VS IOUT, VIN = 3.6 V OUT = 12 V, 15 V, 20 V, 25 V, FSW = HIGH, L = 4.7 μH Figure 1
VS IOUT, VIN = 3.6 V OUT = 12 V, 15 V, 20 V, 25 V, FSW = LOW, L = 10 μH Figure 2
VS IOUT, VIN = 3 V, 3.6 V, 5 V, OUT = 12 V, FSW = HIGH, L = 4.7 μH Figure 3
VS IOUT, VIN = 3 V, 3.6 V, 5 V, OUT = 12 V, FSW = LOW, L = 10 μH Figure 4
Overcurrent Limit VIN = 3.0 V, 3.6 V, 5 V, FSW = High/Low Figure 5, Figure 6, Figure 7, Figure 8
Line Regulation TPS61081, VIN = 2.5 V to 6 V, OUT = 12 V, IOUT = 100 mA Figure 9
Load Regulation TPS61081, VIN = 3.6 V, OUT = 12 V Figure 10

eff_io_lvs644.gif
VI = 3.6 V FSW = HIGH
Figure 1. TPS61081 Efficiency
eff2_io_lvs644.gif
VI = 3.6 V FSW = LOW
Figure 2. TPS61081 Efficiency
eff3_io_lvs644.gif
VO = 12 V FSW = HIGH
Figure 3. TPS61081 Efficiency
ocl_dc_lvs644.gif
FSW = LOW
Figure 5. TPS61080 Overcurrent Limit
ocl3_dc_lvs644.gif
FSW =LOW
Figure 7. TPS61081 Overcurrent Limit
line_reg_lvs644.gif
Figure 9. TPS61081 Line Regulation
eff4_io_lvs644.gif
VO = 12 V FSW = LOW
Figure 4. TPS61081 Efficiency
ocl2_dc_lvs644.gif
FSW =HIGH
Figure 6. TPS61080 Overcurrent Limit
ocl4_dc_lvs644.gif
FSW = HIGH
Figure 8. TPS61081 Overcurrent Limit
load_reg_lvs644.gif
Figure 10. TPS61081 Load Regulation