SLVS992D September   2009  – April 2019 TPS61093

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Shutdown and Load Discharge
      2. 7.3.2 Overload and Overvoltage Protection
      3. 7.3.3 UVLO
      4. 7.3.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 15 V Output Boost Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Output Program
          3. 8.2.1.2.3 Without Isolation FET
          4. 8.2.1.2.4 Start-Up
          5. 8.2.1.2.5 Switch Duty Cycle
          6. 8.2.1.2.6 Inductor Selection
          7. 8.2.1.2.7 Input and Output Capacitor Selection
          8. 8.2.1.2.8 Small Signal Stability
        3. 8.2.1.3 Application Curves
      2. 8.2.2 10 V, –10 V Dual Output Boost Converter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from C Revision (June 2015) to D Revision

Changes from B Revision (December 2014) to C Revision

  • Changed Features From: VSON package To: WSON PackageGo
  • Changed the pinout title From "QFN Package 10 Pins" To: "DSK Package 10 Pins (WSON)"Go
  • Changed "VSON" to "WSON" in the Thermal Information table Go
  • Deleted the Dissipation Ratings tableGo

Changes from A Revision (October 2009) to B Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo

Changes from * Revision (September 2009) to A Revision