SLVS873D June   2015  – April 2016 TPS61098 , TPS610981 , TPS610982 , TPS610985 , TPS610986 , TPS610987

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Boost Controller Operation
      2. 8.3.2 Pass-Through Operation
      3. 8.3.3 LDO / Load Switch Operation
      4. 8.3.4 Start Up and Power Down
      5. 8.3.5 Over Load Protection
      6. 8.3.6 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation Modes by MODE Pin
        1. 8.4.1.1 Active Mode
        2. 8.4.1.2 Low Power Mode
      2. 8.4.2 Burst Mode Operation under Light Load Condition
      3. 8.4.3 Pass-Through Mode Operation
  9. Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 VMAIN to Power MCU and VSUB to Power Subsystem
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Device Choice
          2. 9.2.1.2.2 Maximum Output Current
          3. 9.2.1.2.3 Inductor Selection
          4. 9.2.1.2.4 Capacitor Selection
          5. 9.2.1.2.5 Control Sequence
        3. 9.2.1.3 Application Curves
      2. 9.2.2 VMAIN to Power the System in Low Power Mode
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 VSUB to Power the System in Active Mode
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
    3. 12.3 Related Links
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

As for all switching power supplies, the layout is an important step in the design, especially at high peak currents and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground paths. The input and output capacitor, as well as the inductor should be placed as close as possible to the IC.

11.2 Layout Example

The bottom layer is a large GND plane connected by vias.

TPS61098 TPS610981 TPS610982 TPS610985 TPS610986 TPS610987 tps61098x_layout.gif Figure 96. Layout