SLVSD88L July   2016  – August 2021 TPS61099

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Boost Controller Operation
      2. 8.3.2 Under-Voltage Lockout
      3. 8.3.3 Enable and Disable
      4. 8.3.4 Soft Start
      5. 8.3.5 Current Limit Operation
      6. 8.3.6 Output Short-to-Ground Protection
      7. 8.3.7 Over Voltage Protection
      8. 8.3.8 Down Mode Regulation and Pass-Through Operation
      9. 8.3.9 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Burst Mode Operation under Light Load Condition
      2. 8.4.2 Down Mode Regulation and Pass-Through Mode Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application - 5 V Output Boost Converter
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Detailed Design Procedure
          1. 9.2.1.1.1 Custom Design With WEBENCH® Tools
          2. 9.2.1.1.2 Programming the Output Voltage
          3. 9.2.1.1.3 Maximum Output Current
          4. 9.2.1.1.4 Inductor Selection
          5. 9.2.1.1.5 Capacitor Selection
        2. 9.2.1.2 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 Custom Design With WEBENCH® Tools
      2. 12.1.2 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1)TPS61099UNIT
YFF (6 BALLS, WCSP)DRV(6 PINS, WSON)
RθJAJunction-to-ambient thermal resistance134.471.7°C/W
RθJCtopJunction-to-case (top) thermal resistance0.983.0°C/W
RθJBJunction-to-board thermal resistance36.133.9°C/W
ψJTJunction-to-top characterization parameter0.12.7°C/W
ψJBJunction-to-board characterization parameter36.233.4°C/W
RθJCbotJunction-to-case (bottom) thermal resistanceN/A14.4°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.