SLVSD94E November   2017  – November 2021 TPS62088 , TPS62088A , TPS62089A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings 
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information 
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Save Mode
      2. 8.3.2 Pulse Width Modulation (PWM) Operation
      3. 8.3.3 100% Duty Cycle Low Dropout Operation
      4. 8.3.4 Soft Start
      5. 8.3.5 Switch Current Limit and HICCUP Short-Circuit Protection
      6. 8.3.6 Undervoltage Lockout
      7. 8.3.7 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable and Disable
      2. 8.4.2 Power Good
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Setting The Output Voltage
        3. 9.2.2.3 Feedforward Capacitor
        4. 9.2.2.4 Output Filter Design
        5. 9.2.2.5 Inductor Selection
        6. 9.2.2.6 Capacitor Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 Custom Design With WEBENCH® Tools
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YWC|6
  • YFP|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.1 Design Requirements

For this design example, use the parameters listed in Table 9-1 as the input parameters.

Table 9-1 Design Parameters
DESIGN PARAMETEREXAMPLE VALUE
Input voltage2.4 V to 5.5 V
Output voltage1.8 V
Maximum peak output current3 A

Table 9-2 lists the components used for the example.

Table 9-2 List of Components of Figure 9-1
REFERENCEDESCRIPTIONMANUFACTURER(1)
C14.7 µF, Ceramic capacitor, 6.3 V, X7R, size 0603, JMK107BB7475MATaiyo Yuden
C2, C310 µF, Ceramic capacitor, 10 V, X7R, size 0603, GRM188Z71A106MA73DMurata
C4120 pF, Ceramic capacitor, 50 V, size 0603, GRM1885C1H121JA01DMurata
L10.24 µH, Power Inductor, size 0603, DFE160810S-R24M (DFE18SANR24MG0)Murata
R1Depending on the output voltage, 1%, size 0603Std
R2100 kΩ, Chip resistor, 1/16 W, 1%, size 0603Std
R3100 kΩ, Chip resistor, 1/16 W, 1%, size 0603Std
(1) See Third-party Products disclaimer.
Table 9-3 List of Components of Figure 9-2, Smallest Solution
REFERENCEDESCRIPTIONMANUFACTURER(1)
C1, C2, C310 µF, Ceramic capacitor, 6.3 V, X5R, size 0402, GRM155R60J106ME47Murata
L10.24 µH, Power Inductor, size 0603, DFE160810S-R24M (DFE18SANR24MG0)Murata
R3100 kΩ, Chip resistor, 1/16 W, size 0402Std
(1) See Third-party Products disclaimer.