SLVSD94E November   2017  – November 2021 TPS62088 , TPS62088A , TPS62089A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings 
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information 
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Save Mode
      2. 8.3.2 Pulse Width Modulation (PWM) Operation
      3. 8.3.3 100% Duty Cycle Low Dropout Operation
      4. 8.3.4 Soft Start
      5. 8.3.5 Switch Current Limit and HICCUP Short-Circuit Protection
      6. 8.3.6 Undervoltage Lockout
      7. 8.3.7 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable and Disable
      2. 8.4.2 Power Good
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Setting The Output Voltage
        3. 9.2.2.3 Feedforward Capacitor
        4. 9.2.2.4 Output Filter Design
        5. 9.2.2.5 Inductor Selection
        6. 9.2.2.6 Capacitor Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 Custom Design With WEBENCH® Tools
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YFP|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information 

THERMAL METRIC(1) TPS62088/TPS6208xA UNIT
6 PINS
YFP (6 PINS) YWC (6 PINS) YFP EVM-814 YWC EVM-084
RθJA Junction-to-ambient thermal resistance 141.3 130.9 85.7 70.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 1.7 1.1 n/a (2) n/a (2) °C/W
RθJB Junction-to-board thermal resistance 47.3 27.3 n/a (2) n/a (2) °C/W
ψJT Junction-to-top characterization parameter 0.5 0.7 1.9 0.5 °C/W
ψJB Junction-to-board characterization parameter 47.5 27.2 55.9 38.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Not applicable to an EVM.