SLVSEI1C June   2019  – October 2020 TPS62864 , TPS62866

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Options
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C InterfaceTiming Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Save Mode
      2. 8.3.2 Forced PWM Mode
      3. 8.3.3 Start-up
      4. 8.3.4 Switch Current Limit and HICCUP Short-Circuit Protection
      5. 8.3.5 Undervoltage Lockout (UVLO)
      6. 8.3.6 Thermal Warning and Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable and Disable (EN)
      2. 8.4.2 Output Discharge
      3. 8.4.3 Start-up Output Voltage and I2C Slave Address Selection (VSET)
      4. 8.4.4 Select Output Voltage Registers (VID)
      5. 8.4.5 Power Good (PG)
    5. 8.5 Programming
      1. 8.5.1 Serial Interface Description
      2. 8.5.2 Standard-, Fast-, and Fast-Mode Plus Protocol
      3. 8.5.3 HS-Mode Protocol
      4. 8.5.4 I2C Update Sequence
      5. 8.5.5 I2C Register Reset
    6. 8.6 Register Map
      1. 8.6.1 Slave Address Byte
      2. 8.6.2 Register Address Byte
      3. 8.6.3 VOUT Register 1
      4. 8.6.4 VOUT Register 2
      5. 8.6.5 CONTROL Register
      6. 8.6.6 STATUS Register
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 6-A Output Current Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 9.2.1.2.2 Setting The Output Voltage
          3. 9.2.1.2.3 Output Filter Design
          4. 9.2.1.2.4 Inductor Selection
          5. 9.2.1.2.5 Capacitor Selection
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Smaller Application Solution
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Support Resources
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YCG|15
Thermal pad, mechanical data (Package|Pins)
Orderable Information

CONTROL Register

Table 8-6 CONTROL Register Description
REGISTER ADDRESS 0X03 WRITE ONLY
BITFIELDTYPEDEFAULTDESCRIPTION
7ResetR/W01 - Reset all registers to default.
6Enable FPWM Mode during Output Voltage ChangeR/W10 - Keep the current mode status during output voltage change
1 - Force the device in FPWM during output voltage change
5Software Enable DeviceR/W10 - Disable the device. All registers values are still kept.
1 - Re-enable the device with a new startup without the tDelay period.
4Enable FPWM ModeR/W00 - set the device in power save mode at light loads.
1 - set the device in forced PWM mode at light loads.
3Enable Output DischargeR/W10 - Disable output discharge
1 - Enable output discharge
2Enable HICCUPR/W10 - Disable HICCUP. Enable latching protection.
1 - Enable HICCUP, Disable latching protection.
0:1Voltage Ramp SpeedR/W1100 - 20mV/µs (0.25 µs/step)
01 - 10 mV/µs (0.5 µs/step)
10 - 5 mV/µs (1 µs/step)
11 - 1 mV/µs (5 µs/step, default)