SLVSFS7A March   2021  – January 2024 TPS62901

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Mode Selection and Device Configuration MODE/S-CONF
      2. 6.3.2 Adjustable VO Operation (External Voltage Divider)
      3. 6.3.3 Setable VO Operation (VSET and Internal Voltage Divider)
      4. 6.3.4 Soft Start / Tracking (SS/TR)
      5. 6.3.5 Smart Enable with Precise Threshold
      6. 6.3.6 Power Good (PG)
      7. 6.3.7 Undervoltage Lockout (UVLO)
      8. 6.3.8 Current Limit And Short-Circuit Protection
      9. 6.3.9 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Pulse Width Modulation (PWM) Operation
      2. 6.4.2 AEE (Automatic Efficiency Enhancement)
      3. 6.4.3 Power Save Mode Operation (Auto PFM/PWM)
      4. 6.4.4 100% Duty-Cycle Operation
      5. 6.4.5 Output Discharge Function
      6. 6.4.6 Starting into a Prebiased Load
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application with Adjustable Output Voltage
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Custom Design With WEBENCH® Tools
        2. 7.2.2.2 Programming the Output Voltage
        3. 7.2.2.3 External Component Selection
        4. 7.2.2.4 Inductor Selection
        5. 7.2.2.5 Capacitor Selection
          1. 7.2.2.5.1 Output Capacitor
          2. 7.2.2.5.2 Input Capacitor
          3. 7.2.2.5.3 Soft-Start Capacitor
        6. 7.2.2.6 Tracking Function
        7. 7.2.2.7 Output Filter and Loop Stability
      3. 7.2.3 Application Curves
      4. 7.2.4 Typical Application with Setable VO using VSET
        1. 7.2.4.1 Design Requirements
        2. 7.2.4.2 Detailed Design Procedure
        3. 7.2.4.3 Application Curves
    3. 7.3 System Examples
      1. 7.3.1 LED Power Supply
      2. 7.3.2 Powering Multiple Loads
      3. 7.3.3 Voltage Tracking
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
        1. 7.5.2.1 Thermal Considerations
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Custom Design With WEBENCH® Tools
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • RPJ|9
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5.2.1 Thermal Considerations

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below:

  • Improving the power dissipation capability of the PCB design, for example, increasing copper thickness, thermal vias, number of layers
  • Introducing airflow in the system

For more details on how to use the thermal parameters, see the application notes: Thermal Characteristics Application Note (SZZA017), and (SPRA953).

The TPS62901 is designed for a maximum operating junction temperature (TJ) of 150°C. Therefore, the maximum output power is limited by the power losses that can be dissipated over the actual thermal resistance, given by the package and the surrounding PCB structures. If the thermal resistance of the package is given, the size of the surrounding copper area and a proper thermal connection of the IC can reduce the thermal resistance. To get an improved thermal behavior, it is recommended to use top layer metal to connect the device with wide and thick metal lines. Internal ground layers can connect to vias directly under the IC for improved thermal performance.

If short circuit or overload conditions are present, the device is protected by limiting internal power dissipation.

The device is qualified for long term qualification with 150°C junction. For more details about the derating and life time of the HotRod package, see the application note: SPRACS3.