SLVSFM1A March   2021  – November 2023 TPS62902

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Mode Selection and Device Configuration MODE/S-CONF
      2. 7.3.2 Adjustable VO Operation (External Voltage Divider)
      3. 7.3.3 Setable VO Operation (VSET and Internal Voltage Divider)
      4. 7.3.4 Soft Start / Tracking (SS/TR)
      5. 7.3.5 Smart Enable with Precise Threshold
      6. 7.3.6 Power Good (PG)
      7. 7.3.7 Undervoltage Lockout (UVLO)
      8. 7.3.8 Current Limit And Short Circuit Protection
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pulse Width Modulation (PWM) Operation
      2. 7.4.2 AEE (Automatic Efficiency Enhancement)
      3. 7.4.3 Power Save Mode Operation (Auto PFM/PWM)
      4. 7.4.4 100% Duty-Cycle Operation
      5. 7.4.5 Output Discharge Function
      6. 7.4.6 Starting into a Pre-Biased Load
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application with Adjustable Output Voltage
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Programming the Output Voltage
        3. 8.2.2.3 External Component Selection
        4. 8.2.2.4 Inductor Selection
        5. 8.2.2.5 Capacitor Selection
          1. 8.2.2.5.1 Output Capacitor
          2. 8.2.2.5.2 Input Capacitor
          3. 8.2.2.5.3 Soft-Start Capacitor
        6. 8.2.2.6 Tracking Function
        7. 8.2.2.7 Output Filter and Loop Stability
      3. 8.2.3 Application Curves
      4. 8.2.4 Typical Application with Setable VO using VSET
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
        3. 8.2.4.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 LED Power Supply
      2. 8.3.2 Powering Multiple Loads
      3. 8.3.3 Voltage Tracking
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
        1. 8.5.2.1 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Custom Design With WEBENCH® Tools
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • RPJ|9
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.5.1 Layout Guidelines

A proper layout is critical for the operation of a switched mode power supply, even more at high switching frequencies. Therefore, the PCB layout of the TPS62902 demands careful attention to ensure operation and to get the performance specified. A poor layout can lead to issues like poor regulation (both line and load), stability and accuracy weaknesses, increased EMI radiation, and noise sensitivity.

See Figure 8-86 for the recommended layout of the TPS62902, which is designed for common external ground connections. The input capacitor should be placed as close as possible between the VIN and GND pin of TPS62902. Also, connect the VOS pin in the shortest way to VOUT at the output capacitor.

Provide low inductive and resistive paths for loops with high di/dt. Therefore paths, conducting the switched load current should be as short and wide as possible. Provide low capacitive paths (with respect to all other nodes) for traces with high dv/dt. Therefore, the input and output capacitance should be placed as close as possible to the IC pins and parallel wiring over long distances as well as narrow traces should be avoided. Loops which conduct an alternating current should outline an area as small as possible, as this area is proportional to the energy radiated.

Sensitive nodes like FB and VOS need to be connected with short wires and not nearby high dv/dt signals (for example SW). As they carry information about the output voltage, they should be connected as close as possible to the actual output voltage (at the output capacitor). The capacitor on the SS/TR pin as well as the FB resistors, R1 and R2, should be kept close to the IC and connect directly to those pins and the system ground plane. The same applies to VSET resistor if VSET is used to scale the output voltage.

The package uses the pins for power dissipation. Thermal vias on the VIN and GND pins help to spread the heat through the pcb.

In case any of the digital inputs EN, and MODE/S-CONF need to be tied to the input supply voltage at VIN, the connection must be made directly at the input capacitor as indicated in the schematics.

The recommended layout is implemented on the EVM and shown in its user's guide, SNVU745.