SLVSES3A February   2021  – March 2021 TPS62903

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Mode Selection and Device Configuration MODE/S-CONF
      2. 7.3.2 Adjustable VO Operation (External Voltage Divider)
      3. 7.3.3 Setable VO Operation (VSET and Internal Voltage Divider)
      4. 7.3.4 Soft Start / Tracking (SS/TR)
      5. 7.3.5 Smart Enable with Precise Threshold
      6. 7.3.6 Power Good (PG)
      7. 7.3.7 Undervoltage Lockout (UVLO)
      8. 7.3.8 Current Limit And Short Circuit Protection
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pulse Width Modulation (PWM) Operation
      2. 7.4.2 AEE (Automatic Efficiency Enhancement)
      3. 7.4.3 Power Save Mode Operation (Auto PFM/PWM)
      4. 7.4.4 100% Duty-Cycle Operation
      5. 7.4.5 Output Discharge Function
      6. 7.4.6 Starting into a Pre-Biased Load
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application with Adjustable Output Voltage
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Programming the Output Voltage
        3. 8.2.2.3 External Component Selection
        4. 8.2.2.4 Inductor Selection
        5. 8.2.2.5 Capacitor Selection
          1. 8.2.2.5.1 Output Capacitor
          2. 8.2.2.5.2 Input Capacitor
          3. 8.2.2.5.3 Soft-Start Capacitor
        6. 8.2.2.6 Tracking Function
        7. 8.2.2.7 Output Filter and Loop Stability
      3. 8.2.3 Application Curves
      4. 8.2.4 Typical Application with Setable VO using VSET
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
        3. 8.2.4.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 LED Power Supply
      2. 8.3.2 Powering Multiple Loads
      3. 8.3.3 Voltage Tracking
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • RPJ|9
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS6290x UNIT
VQFN 9-Pin
JEDEC PCB TPS6290xEVM-069
RθJA Junction-to-ambient thermal resistance                       97.2                       73.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance                       74.4                        N/A °C/W
RθJB Junction-to-board thermal resistance                        25                        N/A °C/W
ΨJT Junction-to-top characterization parameter                        2.7                         4.3 °C/W
ΨJB Junction-to-board characterization parameter                        24.7                         28 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.