SLVSFP4B August   2020  – March 2021 TPS62912 , TPS62913

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Smart Config (S-CONF)
      2. 7.3.2  Device Enable (EN/SYNC)
      3. 7.3.3  Device Synchronization (EN/SYNC)
      4. 7.3.4  Spread Spectrum Modulation
      5. 7.3.5  Output Discharge
      6. 7.3.6  Undervoltage Lockout (UVLO)
      7. 7.3.7  Power-Good Output
      8. 7.3.8  Noise Reduction and Soft-Start Capacitor (NR/SS)
      9. 7.3.9  Current Limit and Short Circuit Protection
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Fixed Frequency Pulse Width Modulation
      2. 7.4.2 Low Duty Cycle Operation
      3. 7.4.3 High Duty Cycle Operation (100% Duty Cycle)
      4. 7.4.4 Second Stage L-C Filter Compensation (Optional)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 External Component Selection
          1. 8.2.2.2.1 Switching Frequency Selection
          2. 8.2.2.2.2 Inductor Selection for the First L-C Filter
          3. 8.2.2.2.3 Output Capacitor Selection
          4. 8.2.2.2.4 Ferrite Bead Selection for Second L-C Filter
          5. 8.2.2.2.5 Input Capacitor Selection
          6. 8.2.2.2.6 Setting the Output Voltage
          7. 8.2.2.2.7 NR/SS Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.7 Power-Good Output

The device has a power-good output. The PG pin goes high impedance once the FB pin voltage is above 95% of the nominal voltage, and is driven low once the voltage falls below typically 90% of the nominal voltage. Table 7-2 shows the typical PG pin logic. The PG pin is an open-drain output and is specified to sink up to 10 mA. The power-good output requires a pullup resistor connecting to any voltage rail less than 18 V. The PG signal can be used for sequencing of multiple rails by connecting to the EN pin of other converters. If not used, the PG pin can be left floating or connected to GND. PG has a deglitch time of typically 8 μs before going low.

Table 7-2 Power Good Pin Logic
DEVICE STATE PG LOGIC STATUS
HIGH IMPEDANCE LOW
Enabled (EN/SYNC = High) VFB ≥ VPG

√
VFB < VPG after tPG √
Shutdown (EN/SYNC = Low) √
UVLO

0.7 V < VIN < VUVLO

 √
Thermal Shutdown

TJ > TJSD

 √
Power Supply Removal

VIN < 0.7 V

 √