SLUSEA4D June   2021  – August 2022 TPS62932 , TPS62933 , TPS62933F , TPS62933O , TPS62933P

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Fixed Frequency Peak Current Mode
      2. 9.3.2  Pulse Frequency Modulation
      3. 9.3.3  Voltage Reference
      4. 9.3.4  Output Voltage Setting
      5. 9.3.5  Switching Frequency Selection
      6. 9.3.6  Enable and Adjusting Undervoltage Lockout
      7. 9.3.7  External Soft Start and Prebiased Soft Start
      8. 9.3.8  Power Good
      9. 9.3.9  Minimum On Time, Minimum Off Time, and Frequency Foldback
      10. 9.3.10 Frequency Spread Spectrum
      11. 9.3.11 Overvoltage Protection
      12. 9.3.12 Overcurrent and Undervoltage Protection
      13. 9.3.13 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Modes Overview
      2. 9.4.2 Heavy Load Operation
      3. 9.4.3 Light Load Operation
      4. 9.4.4 Out of Audio Operation
      5. 9.4.5 Forced Continuous Conduction Operation
      6. 9.4.6 Dropout Operation
      7. 9.4.7 Minimum On-Time Operation
      8. 9.4.8 Shutdown Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1  Custom Design With WEBENCH® Tools
        2. 10.2.2.2  Output Voltage Resistors Selection
        3. 10.2.2.3  Choosing Switching Frequency
        4. 10.2.2.4  Soft-Start Capacitor Selection
        5. 10.2.2.5  Bootstrap Capacitor Selection
        6. 10.2.2.6  Undervoltage Lockout Setpoint
        7. 10.2.2.7  Output Inductor Selection
        8. 10.2.2.8  Output Capacitor Selection
        9. 10.2.2.9  Input Capacitor Selection
        10. 10.2.2.10 Feedforward Capacitor CFF Selection
        11. 10.2.2.11 Maximum Ambient Temperature
      3. 10.2.3 Application Curves
    3. 10.3 What to Do and What Not to Do
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
      2. 13.1.2 Development Support
        1. 13.1.2.1 Custom Design With WEBENCH® Tools
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4 Thermal Information

THERMAL METRIC(1)TPS6293xUNIT
DRL (SOT583), 8 PINS
JEDEC(2)EVM(3)
RθJAJunction-to-ambient thermal resistance112.2N/A°C/W
RθJC(top)Junction-to-case (top) thermal resistance29.1N/A°C/W
RθJBJunction-to-board thermal resistance19.3N/A°C/W
ΨJTJunction-to-top characterization parameter1.6N/A°C/W
ΨJBJunction-to-board characterization parameter19.2N/A°C/W
RθJA_EVMJunction-to-ambient thermal resistance on official EVM boardN/A60.2°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The value of RθJA given in this table is only valid for comparison with other packages and can not be used for design purposes. These values were simulated on a standard JEDEC board. They do not represent the performance obtained in an actual application.
(3) The real RθJA is tested on TI EVM (2 layer, 2-ounce copper thickness).