SLVSDS9C July   2018  – October 2019 TPS63805 , TPS63806

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Typical Application
      2.      Efficiency vs Output Current (VO = 3.3 V)
  4. Revision History
  5. Description (continued)
  6. Device Comparison Table
  7. Pin Configuration and Functions
    1.     Pin Functions Table
  8. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Control Loop Description
      2. 9.3.2  Precise Device Enable: Threshold- or Delayed Enable
      3. 9.3.3  Mode Selection (PFM/PWM)
      4. 9.3.4  Undervoltage Lockout (UVLO)
      5. 9.3.5  Soft-start
      6. 9.3.6  Adjustable Output Voltage
      7. 9.3.7  Overtemperature Protection - Thermal Shutdown
      8. 9.3.8  Input Overvoltage - Reverse-Boost Protection (IVP)
      9. 9.3.9  Output Overvoltage Protection (OVP)
      10. 9.3.10 Power-Good Indicator
    4. 9.4 Device Functional Modes
      1. 9.4.1 Peak-Current Mode Architecture
        1. 9.4.1.1 Reverse Current Operation, Negative Current
        2. 9.4.1.2 Boost Operation
        3. 9.4.1.3 Buck-Boost Operation
        4. 9.4.1.4 Buck Operation
      2. 9.4.2 Power Save Mode Operation
        1. 9.4.2.1 Current Limit Operation
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Custom Design With WEBENCH® Tools
        2. 10.2.2.2 Inductor Selection
        3. 10.2.2.3 Output Capacitor Selection
        4. 10.2.2.4 Input Capacitor Selection
        5. 10.2.2.5 Setting The Output Voltage
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
      2. 13.1.2 Custom Design With WEBENCH® Tools
      3. 13.1.3 Development Support
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.