SWCS142 July   2018 TPS650861

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 PMIC Functional Block Diagram
  2. 2Revision History
  3. 3Pin Configuration and Functions
    1. 3.1 Pin Functions
      1.      Pin Functions
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Information
    5. 4.5  Electrical Characteristics: Total Current Consumption
    6. 4.6  Electrical Characteristics: Reference and Monitoring System
    7. 4.7  Electrical Characteristics: Buck Controllers
    8. 4.8  Electrical Characteristics: Synchronous Buck Converters
    9. 4.9  Electrical Characteristics: LDOs
    10. 4.10 Electrical Characteristics: Load Switches
    11. 4.11 Digital Signals: I2C Interface
    12. 4.12 Digital Input Signals (CTLx)
    13. 4.13 Digital Output Signals (IRQB, GPOx)
    14. 4.14 Timing Requirements
    15. 4.15 Switching Characteristics
    16. 4.16 Typical Characteristics
  5. 5Detailed Description
    1. 5.1  Overview
    2. 5.2  Functional Block Diagram
    3. 5.3  Programming the TPS650861
    4. 5.4  SMPS Voltage Regulators
      1. 5.4.1 Controller Overview
      2. 5.4.2 Converter Overview
      3. 5.4.3 DVS
      4. 5.4.4 Decay
      5. 5.4.5 Current Limit
    5. 5.5  LDOs and Load Switches
      1. 5.5.1 VTT LDO
      2. 5.5.2 LDOA1–LDOA3
      3. 5.5.3 Load Switches
    6. 5.6  Power Goods (PGOOD or PG) and GPOs
    7. 5.7  One-Time Programmable Memory
    8. 5.8  Power Sequencing and VR Control
      1. 5.8.1 CTLx Sequencing
      2. 5.8.2 PG Sequencing
      3. 5.8.3 Enable Delay
      4. 5.8.4 Power-Up Sequence
      5. 5.8.5 Power-Down Sequence
      6. 5.8.6 Sleep State Entry and Exit
      7. 5.8.7 Emergency Shutdown
    9. 5.9  Device Functional Modes
      1. 5.9.1 Off Mode
      2. 5.9.2 Standby Mode
      3. 5.9.3 Active Mode
    10. 5.10 I2C Interface
      1. 5.10.1 F/S-Mode Protocol
    11. 5.11 I2C Address: 0x5E Register Maps
      1. 5.11.1  Register Map Summary
      2. 5.11.2  DEVICEID1: 1st PMIC Device and Revision ID Register (offset = 00h) [reset = X]
        1. Table 5-8 DEVICEID1 Register Descriptions
      3. 5.11.3  DEVICEID2: 2nd PMIC Device and Revision ID Register (offset = 01h) [reset = X]
        1. Table 5-9 DEVICEID2 Register Descriptions
      4. 5.11.4  IRQ: PMIC Interrupt Register (offset = 02h) [reset = 0000 0000]
        1. Table 5-10 IRQ Register Descriptions
      5. 5.11.5  IRQ_MASK: PMIC Interrupt Mask Register (offset = 03h) [reset = 1111 1111]
        1. Table 5-11 IRQ_MASK Register Descriptions
      6. 5.11.6  PMICSTAT: PMIC Status Register (offset = 04h) [reset = 0000 0000]
        1. Table 5-12 PMICSTAT Register Descriptions
      7. 5.11.7  SHUTDNSRC: PMIC Shut-Down Event Register (offset = 05h) [reset = 0000 0000]
        1. Table 5-13 SHUTDNSRC Register Descriptions
      8. 5.11.8  BUCK1CTRL: BUCK1 Control Register (offset = 20h) [reset = X]
        1. Table 5-14 BUCK1CTRL Register Descriptions
      9. 5.11.9  BUCK2CTRL: BUCK2 Control Register (offset = 21h) [reset = X]
        1. Table 5-15 BUCK2CTRL Register Descriptions
      10. 5.11.10 BUCK3DECAY: BUCK3 Decay Control Register (offset = 22h) [reset = X]
        1. Table 5-16 BUCK3DECAY Register Descriptions
      11. 5.11.11 BUCK3VID: BUCK3 VID Register (offset = 23h) [reset = X]
        1. Table 5-17 BUCK3VID Register Descriptions
      12. 5.11.12 BUCK3SLPCTRL: BUCK3 Sleep Control VID Register (offset = 24h) [reset = X]
        1. Table 5-18 BUCK3SLPCTRL Register Descriptions
      13. 5.11.13 BUCK4CTRL: BUCK4 Control Register (offset = 25h) [reset = X]
        1. Table 5-19 BUCK4CTRL Register Descriptions
      14. 5.11.14 BUCK5CTRL: BUCK5 Control Register (offset = 26h) [reset = X]
        1. Table 5-20 BUCK5CTRL Register Descriptions
      15. 5.11.15 BUCK6CTRL: BUCK6 Control Register (offset = 27h) [reset = X]
        1. Table 5-21 BUCK6CTRL Register Descriptions
      16. 5.11.16 LDOA2CTRL: LDOA2 Control Register (offset = 28h) [reset = X]
        1. Table 5-22 LDOA2CTRL Register Descriptions
      17. 5.11.17 LDOA3CTRL: LDOA3 Control Register (offset = 29h) [reset = X]
        1. Table 5-23 LDOA3CTRL Register Descriptions
      18. 5.11.18 DISCHCTRL1: 1st Discharge Control Register (offset = 40h) [reset = X]
        1. Table 5-24 DISCHCTRL1 Register Descriptions
      19. 5.11.19 DISCHCTRL2: 2nd Discharge Control Register (offset = 41h) [reset = X]
        1. Table 5-25 DISCHCTRL2 Register Descriptions
      20. 5.11.20 DISCHCTRL3: 3rd Discharge Control Register (offset = 42h) [reset = X]
        1. Table 5-26 DISCHCTRL3 Register Descriptions
      21. 5.11.21 PG_DELAY1: 1st Power Good Delay Register (offset = 43h) [reset = X]
        1. Table 5-27 PG_DELAY1 Register Descriptions
      22. 5.11.22 FORCESHUTDN: Force Emergency Shutdown Control Register (offset = 91h) [reset = 0000 0000]
        1. Table 5-28 FORCESHUTDN Register Descriptions
      23. 5.11.23 BUCK1SLPCTRL: BUCK1 Sleep Control Register (offset = 92h) [reset = X]
        1. Table 5-29 BUCK1SLPCTRL Register Descriptions
      24. 5.11.24 BUCK2SLPCTRL: BUCK2 Sleep Control Register (offset = 93h) [reset = X]
        1. Table 5-30 BUCK2SLPCTRL Register Descriptions
      25. 5.11.25 BUCK4VID: BUCK4 VID Register (offset = 94h) [reset = X]
        1. Table 5-31 BUCK4VID Register Descriptions
      26. 5.11.26 BUCK4SLPVID: BUCK4 Sleep VID Register (offset = 95h) [reset = X]
        1. Table 5-32 BUCK4SLPVID Register Descriptions
      27. 5.11.27 BUCK5VID: BUCK5 VID Register (offset = 96h) [reset = X]
        1. Table 5-33 BUCK5VID Register Descriptions
      28. 5.11.28 BUCK5SLPVID: BUCK5 Sleep VID Register (offset = 97h) [reset = X]
        1. Table 5-34 BUCK5SLPVID Register Descriptions
      29. 5.11.29 BUCK6VID: BUCK6 VID Register (offset = 98h) [reset = X]
        1. Table 5-35 BUCK6VID Register Descriptions
      30. 5.11.30 BUCK6SLPVID: BUCK6 Sleep VID Register (offset = 99h) [reset = X]
        1. Table 5-36 BUCK6SLPVID Register Descriptions
      31. 5.11.31 LDOA2VID: LDOA2 VID Register (offset = 9Ah) [reset = X]
        1. Table 5-37 LDOA2VID Register Descriptions
      32. 5.11.32 LDOA3VID: LDOA3 VID Register (offset = 9Bh) [reset = X]
        1. Table 5-38 LDOA3VID Register Descriptions
      33. 5.11.33 BUCK123CTRL: BUCK1-3 Control Register (offset = 9Ch) [reset = X]
        1. Table 5-39 BUCK123CTRL Register Descriptions
      34. 5.11.34 PG_DELAY2: 2nd Power Good Delay Register (offset = 9Dh) [reset = X]
        1. Table 5-40 PG_DELAY2 Register Descriptions
      35. 5.11.35 SWVTT_DIS: SWVTT Disable Register (offset = 9Fh) [reset = X]
        1. Table 5-41 SWVTT_DIS Register Descriptions
      36. 5.11.36 I2C_RAIL_EN1: 1st VR Pin Enable Override Register (offset = A0h) [reset = X]
        1. Table 5-42 I2C_RAIL_EN1 Register Descriptions
      37. 5.11.37 I2C_RAIL_EN2/GPOCTRL: 2nd VR Pin Enable Override and GPO Control Register (offset = A1h) [reset = X]
        1. Table 5-43 I2C_RAIL_EN2/GPOCTRL Register Descriptions
      38. 5.11.38 PWR_FAULT_MASK1: 1st VR Power Fault Mask Register (offset = A2h) [reset = X]
        1. Table 5-44 PWR_FAULT_MASK1 Register Descriptions
      39. 5.11.39 PWR_FAULT_MASK2: 2nd VR Power Fault Mask Register (offset = A3h) [reset = X]
        1. Table 5-45 PWR_FAULT_MASK2 Register Descriptions
      40. 5.11.40 GPO1PG_CTRL1: 1st GPO1 PG Control Register (offset = A4h) [reset = X]
        1. Table 5-46 GPO1PG_CTRL1 Register Descriptions
      41. 5.11.41 GPO1PG_CTRL2: 2nd GPO1 PG Control Register (offset = A5h) [reset = X]
        1. Table 5-47 GPO1PG_CTRL2 Register Descriptions
      42. 5.11.42 GPO4PG_CTRL1: 1st GPO4 PG Control Register (offset = A6h) [reset = X]
        1. Table 5-48 GPO4PG_CTRL1 Register Descriptions
      43. 5.11.43 GPO4PG_CTRL2: 2nd GPO4 PG Control Register (offset = A7h) [reset = X]
        1. Table 5-49 GPO4PG_CTRL2 Register Descriptionsr
      44. 5.11.44 GPO2PG_CTRL1: 1st GPO2 PG Control Register (offset = A8h) [reset = X]
        1. Table 5-50 GPO2PG_CTRL1 Register Descriptions
      45. 5.11.45 GPO2PG_CTRL2: 2nd GPO2 PG Control Register (offset = A9h) [reset = X]
        1. Table 5-51 GPO2PG_CTRL2 Register Descriptions
      46. 5.11.46 GPO3PG_CTRL1: 1st GPO3 PG Control Register (offset = AAh) [reset = X]
        1. Table 5-52 GPO3PG_CTRL1 Register Descriptions
      47. 5.11.47 GPO3PG_CTRL2: 2nd GPO3 PG Control Register (offset = ABh) [reset = X]
        1. Table 5-53 GPO3PG_CTRL2 Register Descriptions
      48. 5.11.48 MISCSYSPG Register (offset = ACh) [reset = X]
        1. Table 5-54 MISCSYSPG Register Descriptions
        2. 5.11.48.1   VTT_DISCH_CTRL Register (offset = ADh) [reset = X]
          1. Table 5-55 VTT_DISCH_CTRL Register Descriptions
      49. 5.11.49 LDOA1_SWB2_CTRL: LDOA1 and SWB2 Control Register (offset = AEh) [reset = X]
        1. Table 5-56 LDOA1_SWB2_CTRL Register Descriptions
      50. 5.11.50 PG_STATUS1: 1st Power Good Status Register (offset = B0h) [reset = 0000 0000]
        1. Table 5-57 PG_STATUS1 Register Descriptions
      51. 5.11.51 PG_STATUS2: 2nd Power Good Status Register (offset = B1h) [reset = 0000 0000]
        1. Table 5-58 PG_STATUS2 Register Descriptions
      52. 5.11.52 PWR_FAULT_STATUS1: 1st Power Fault Status Register (offset = B2h) [reset = 0000 0000]
        1. Table 5-59 PWR_FAULT_STATUS1 Register Descriptions
      53. 5.11.53 PWR_FAULT_STATUS2: 2nd Power Fault Status Register (offset = B3h) [reset = 0000 0000]
        1. Table 5-60 PWR_FAULT_STATUS2 Register Descriptions
      54. 5.11.54 TEMPCRIT: Temperature Fault Status Register (offset = B4h) [reset = 0000 0000]
        1. Table 5-61 TEMPCRIT Register Descriptions
      55. 5.11.55 TEMPHOT: Temperature Hot Status Register (offset = B5h) [reset = 0000 0000]
        1. Table 5-62 TEMPHOT Register Descriptions
      56. 5.11.56 OC_STATUS: Overcurrent Fault Status Register (offset = B6h) [reset = 0000 0000]
        1. Table 5-63 OC_STATUS Register Descriptions
    12. 5.12 I2C Address: 0x38 Register Maps
      1. 5.12.1  Register Map Summary
      2. 5.12.2  OTP_CTRL1 (offset = 02h) [reset = 0010 0000]
        1. Table 5-65 OTP_CTRL1 Register Descriptions
      3. 5.12.3  OTP_CTRL2 (offset = 03h) [reset = X]
        1. Table 5-66 OTP_CTRL2 Register Descriptions
      4. 5.12.4  BUCK1_CTRL_EN1 (offset = 07h) [reset = X]
        1. Table 5-67 BUCK1_CTRL_EN1 Register Descriptions
      5. 5.12.5  BUCK1_CTRL_EN2 (offset = 08h) [reset = X]
        1. Table 5-68 BUCK1_CTRL_EN2 Register Descriptions
      6. 5.12.6  BUCK1_CTRL_EN3 (offset = 09h) [reset = X]
        1. Table 5-69 BUCK1_CTRL_EN3 Register Descriptions
      7. 5.12.7  BUCK2_CTRL_EN1 (offset = 0Ah) [reset = X]
        1. Table 5-70 BUCK2_CTRL_EN1 Register Descriptions
      8. 5.12.8  BUCK2_CTRL_EN2 (offset = 0Bh) [reset = X]
        1. Table 5-71 BUCK2_CTRL_EN2 Register Descriptions
      9. 5.12.9  BUCK2_CTRL_EN3 (offset = 0Ch) [reset = X]
        1. Table 5-72 BUCK2_CTRL_EN3 Register Descriptions
      10. 5.12.10 BUCK3_CTRL_EN1 (offset = 0Ah) [reset = X]
        1. Table 5-73 BUCK3_CTRL_EN1 Register Descriptions
      11. 5.12.11 BUCK3_CTRL_EN2 (offset = 0Eh) [reset = X]
        1. Table 5-74 BUCK3_CTRL_EN2 Register Descriptions
      12. 5.12.12 BUCK3_CTRL_EN3 (offset = 0Fh) [reset = X]
        1. Table 5-75 BUCK3_CTRL_EN3 Register Descriptions
      13. 5.12.13 BUCK4_CTRL_EN1 (offset = 10h) [reset = X]
        1. Table 5-76 BUCK4_CTRL_EN1 Register Descriptions
      14. 5.12.14 BUCK4_CTRL_EN2 (offset = 11h) [reset = X]
        1. Table 5-77 BUCK4_CTRL_EN2 Register Descriptions
      15. 5.12.15 BUCK4_CTRL_EN3 (offset = 12h) [reset = X]
        1. Table 5-78 BUCK4_CTRL_EN3 Register Descriptions
      16. 5.12.16 BUCK5_CTRL_EN1 (offset = 13h) [reset = X]
        1. Table 5-79 BUCK5_CTRL_EN1 Register Descriptions
      17. 5.12.17 BUCK5_CTRL_EN2 (offset = 14h) [reset = X]
        1. Table 5-80 BUCK5_CTRL_EN2 Register Descriptions
      18. 5.12.18 BUCK5_CTRL_EN3 (offset = 15h) [reset = X]
        1. Table 5-81 BUCK5_CTRL_EN3 Register Descriptions
      19. 5.12.19 BUCK6_CTRL_EN1 (offset = 16h) [reset = X]
        1. Table 5-82 BUCK6_CTRL_EN1 Register Descriptions
      20. 5.12.20 BUCK6_CTRL_EN2 (offset = 17h) [reset = X]
        1. Table 5-83 BUCK6_CTRL_EN2 Register Descriptions
      21. 5.12.21 BUCK6_CTRL_EN3 (offset = 18h) [reset = X]
        1. Table 5-84 BUCK6_CTRL_EN3 Register Descriptions
      22. 5.12.22 SWA1_CTRL_EN1 (offset = 19h) [reset = X]
        1. Table 5-85 SWA1_CTRL_EN1 Register Descriptions
      23. 5.12.23 SWA1_CTRL_EN2 (offset = 1Ah) [reset = X]
        1. Table 5-86 SWA1_CTRL_EN2 Register Descriptions
      24. 5.12.24 SWA1_CTRL_EN3 (offset = 1Bh) [reset = X]
        1. Table 5-87 SWA1_CTRL_EN3 Register Descriptions
      25. 5.12.25 LDOA2_CTRL_EN1 (offset = 1Ch) [reset = X]
        1. Table 5-88 LDOA2_CTRL_EN1 Register Descriptions
      26. 5.12.26 LDOA2_CTRL_EN2 (offset = 1Dh) [reset = X]
        1. Table 5-89 LDOA2_CTRL_EN2 Register Descriptions
      27. 5.12.27 LDOA2_CTRL_EN3 (offset = 1Eh) [reset = X]
        1. Table 5-90 LDOA2_CTRL_EN3 Register Descriptions
      28. 5.12.28 LDOA3_CTRL_EN1 (offset = 1Fh) [reset = X]
        1. Table 5-91 LDOA3_CTRL_EN1 Register Descriptions
      29. 5.12.29 LDOA3_CTRL_EN2 (offset = 20h) [reset = X]
        1. Table 5-92 LDOA3_CTRL_EN2 Register Descriptions
      30. 5.12.30 LDOA3_CTRL_EN3 (offset = 21h) [reset = X]
        1. Table 5-93 LDOA3_CTRL_EN3 Register Descriptions
      31. 5.12.31 SWB1_CTRL_EN1 (offset = 22h) [reset = X]
        1. Table 5-94 SWB1_CTRL_EN1 Register Descriptions
      32. 5.12.32 SWB1_CTRL_EN2 (offset = 23h) [reset = X]
        1. Table 5-95 SWB1_CTRL_EN2 Register Descriptions
      33. 5.12.33 SWB1_CTRL_EN3 (offset = 24h) [reset = X]
        1. Table 5-96 SWB1_CTRL_EN3 Register Descriptions
      34. 5.12.34 SWB2_LDOA1_CTRL_EN1 (offset = 25h) [reset = X]
        1. Table 5-97 SWB2_LDOA1_CTRL_EN1 Register Descriptions
      35. 5.12.35 SWB2_LDOA1_CTRL_EN2 (offset = 26h) [reset = X]
        1. Table 5-98 SWB2_LDOA1_CTRL_EN2 Register Descriptions
      36. 5.12.36 SWB2_LDOA1_CTRL_EN3 (offset = 27h) [reset = X]
        1. Table 5-99 SWB2_LDOA1_CTRL_EN3 Register Descriptions
      37. 5.12.37 SLP_PIN (offset = 29h) [reset = X]
        1. Table 5-100 SLP_PIN Register Descriptions
      38. 5.12.38 OUTPUT_MODE (offset = 2Ah) [reset = X]
        1. Table 5-101 OUTPUT_MODE Register Descriptions
      39. 5.12.39 I2C_SLAVE_ADDR (offset = 5Fh) [reset = X]
        1. Table 5-102 I2C_SLAVE_ADDR Register Descriptions
  6. 6Applications, Implementation, and Layout
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Typical Application Example
        1. 6.2.1.1 Design Requirements
        2. 6.2.1.2 Detailed Design Procedure
          1. 6.2.1.2.1 Controller Design Procedure
            1. 6.2.1.2.1.1 Selecting the Inductor
            2. 6.2.1.2.1.2 Selecting the Output Capacitors
            3. 6.2.1.2.1.3 Selecting the FETs
            4. 6.2.1.2.1.4 Bootstrap Capacitor
            5. 6.2.1.2.1.5 Setting the Current Limit
            6. 6.2.1.2.1.6 Selecting the Input Capacitors
          2. 6.2.1.2.2 Converter Design Procedure
            1. 6.2.1.2.2.1 Selecting the Inductor
            2. 6.2.1.2.2.2 Selecting the Output Capacitors
            3. 6.2.1.2.2.3 Selecting the Input Capacitors
          3. 6.2.1.2.3 LDO Design Procedure
        3. 6.2.1.3 Application Curves
        4. 6.2.1.4 Layout
          1. 6.2.1.4.1 Layout Guidelines
          2. 6.2.1.4.2 Layout Example
      2. 6.2.2 VIN 5-V Application
        1. 6.2.2.1 Design Requirements
        2. 6.2.2.2 Design Procedure
        3. 6.2.2.3 Application Curves
    3. 6.3 Power Supply Coupling and Bulk Capacitors
    4. 6.4 Do's and Don'ts
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation
    3. 7.3 Receiving Notification of Documentation Updates
    4. 7.4 Community Resources
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3.1 Pin Functions

Pin Functions

PIN I/O DESCRIPTION
NO. NAME
SMPS REGULATORS
1 FBGND2 I Remote negative feedback sense for BUCK2 controller. Connect to negative terminal of output capacitor. Connect to ground when not in use.
2 FBVOUT2 I Remote positive feedback sense for BUCK2 controller. Connect to positive terminal of output capacitor. Connect to ground when not in use.
3 DRVH2 O High-side gate driver output for BUCK2 controller. Leave floating when not in use.
4 SW2 I Switch node connection for BUCK2 controller. Connect to ground when not in use.
5 BOOT2 I Bootstrap pin for BUCK2 controller. Connect a 100-nF ceramic capacitor between this pin and SW2 pin. Leave floating when not in use.
6 PGNDSNS2 I Power GND connection for BUCK2. Connect to ground terminal of external low-side FET. Connect to ground when not in use.
7 DRVL2 O Low-side gate driver output for BUCK2 controller. Leave floating when not in use.
8 DRV5V_2_A1 I 5-V supply to BUCK2 gate driver and LDOA1. Bypass to ground with a 2.2-µF (typical) ceramic capacitor. Shorted on board to LDO5P0 pin typically. Bypass not required if BUCK2 and LDOA1 are not in use.
10 LX3 O Switch node connection for BUCK3 converter. Connect to ground when not in use.
11 PVIN3 I Power input to BUCK3 converter. Bypass to ground with a 10-µF (typical) ceramic capacitor. Bypass not required if BUCK3 is not in use.
12 FB3 I Remote feedback sense for BUCK3 converter. Connect to positive terminal of output capacitor. Connect to ground when not in use.
20 LX5 O Switch node connection for BUCK5 converter. Leave floating when not in use.
21 PVIN5 I Power input to BUCK5 converter. Bypass to ground with a 10-µF (typical) ceramic capacitor. Bypass not required if BUCK5 is not in use.
22 FB5 I Remote feedback sense for BUCK5 converter. Connect to positive terminal of output capacitor. Connect to ground when not in use.
23 FB4 I Remote feedback sense for BUCK4 converter. Connect to positive terminal of output capacitor. Connect to ground when not in use.
24 PVIN4 I Power input to BUCK4 converter. Bypass to ground with a 10-µF (typical) ceramic capacitor. Bypass not required if BUCK4 is not in use.
25 LX4 O Switch node connection for BUCK4 converter. Leave floating when not in use.
29 FBVOUT1 I Remote feedback sense for BUCK1 controller. Connect to positive terminal of output capacitor. Connect to ground when not in use.
30 ILIM1 I Current limit set pin for BUCK1 controller. Fit a resistor from this pin to ground to set current limit of external low-side FET. Connect to ground when BUCK1 not in use.
33 DRVH1 O High-side gate driver output for BUCK1 controller. Leave floating when not in use.
34 SW1 I Switch node connection for BUCK1 controller. Connect to ground when not in use.
35 BOOT1 I Bootstrap pin for BUCK1 controller. Connect a 100-nF ceramic capacitor between this pin and SW1 pin. Leave floating when not in use.
36 PGNDSNS1 I Power GND connection for BUCK1. Connect to ground terminal of external low-side FET. Connect to ground when not in use.
37 DRVL1 O Low-side gate driver output for BUCK1 controller. Leave floating when not in use.
38 DRV5V_1_6 I 5-V supply to BUCK1 and BUCK6 gate drivers. Bypass to ground with a 2.2-µF (typical) ceramic capacitor. Shorted on board to LDO5P0 pin typically. Bypass not required if BUCK1 and BUCK6 are not in use.
39 DRVL6 O Low-side gate driver output for BUCK6 controller. Leave floating when not in use.
40 PGNDSNS6 I Power GND connection for BUCK6. Connect to ground terminal of external low-side FET. Connect to ground when not in use.
41 BOOT6 I Bootstrap pin for BUCK6 controller. Connect a 100-nF ceramic capacitor between this pin and SW6 pin. Leave floating when not in use.
42 SW6 I Switch node connection for BUCK6 controller. Connect to ground when not in use.
43 DRVH6 O High-side gate driver output for BUCK6 controller. Leave floating when not in use.
44 FBVOUT6 I Remote feedback sense for BUCK6 controller and reference voltage for VTT LDO regulation. Connect to positive terminal of output capacitor. Connect to ground when not in use.
45 ILIM6 I Current limit set pin for BUCK6 controller. Fit a resistor from this pin to ground to set current limit of external low-side FET. Connect to ground when BUCK6 not in use.
64 ILIM2 I Current limit set pin for BUCK2 controller. Fit a resistor from this pin to ground to set current limit of external low-side FET. Connect to ground when BUCK2 not in use.
LDO AND LOAD SWITCHES
9 LDOA1 O LDOA1 output. Bypass to ground with a 4.7-µF (typical) ceramic capacitor. Leave floating when not in use.
17 SWB1 O Output of load switch B1. Bypass to ground with a 0.1-µF (typical) ceramic capacitor. Leave floating when not in use.
18 PVINSWB1_B2 I Power supply to load switch B1 and B2. Bypass to ground with a 1-µF (typical) ceramic capacitor to improve transient performance. Connect to ground when not in use.
19 SWB2 O Output of load switch B2. Bypass to ground with a 0.1-µF (typical) ceramic capacitor. Leave floating when not in use.
31 SWA1 O Output of load switch A1. Bypass to ground with a 0.1-µF (typical) ceramic capacitor. Leave floating when not in use.
32 PVINSWA1 I Power supply to load switch A1. Bypass to ground with a 1-µF (typical) ceramic capacitor to improve transient performance. Connect to ground when not in use.
46 PVINVTT I Power supply to VTT LDO. Bypass to ground with a 10-µF (minimum) ceramic capacitor. Bypass not required if VTT LDO is not in use.
47 VTT O Output of load VTT LDO. Bypass to ground with 2× 22-µF (minimum) ceramic capacitors. Leave floating when not in use.
48 VTTFB I Remote feedback sense for VTT LDO. Connect to positive terminal of output capacitor. Connect to ground when not in use.
49 LDOA3 O Output of LDOA3. Bypass to ground with a 4.7-µF (typical) ceramic capacitor. Leave floating when not in use.
50 PVINLDOA2_A3 I Power supply to LDOA2 and LDOA3. Bypass to ground with a 4.7-µF (typical) ceramic capacitor. Connect to ground when not in use.
51 LDOA2 O Output of LDOA2. Bypass to ground with a 4.7-µF (typical) ceramic capacitor. Leave floating when not in use.
54 LDO3P3 O Output of 3.3-V internal LDO. Bypass to ground with a 4.7-µF (typical) ceramic capacitor.
56 LDO5P0 O Output of 5-V internal LDO or an internal switch that connects this pin to V5ANA. Bypass to ground with a 4.7-µF (typical) ceramic capacitor.
57 V5ANA I Bias used by converters (BUCK3, BUCK4, and BUCK5) for regulation. Must be same supply as PVINx. Also has an internal load switch that connects this pin to LDO5P0 pin if 5-V is used. Bypass this pin with an optional ceramic capacitor to improve transient performance.
INTERFACE
13 CTL1 I Active-high VR enable pin. A group of VRs can be assigned to be enabled at assertion or disabled at deassertion of this pin.
14 CTL6/SLPENB2 I Active-high VR enable pin. A group of VRs can be assigned to be enabled at assertion or disabled at deassertion of this pin. Alternatively, when configured to active-low sleep enable, a group of VRs chosen can be entered into (L) or out of (H) sleep state where their output voltages may be different from those in normal state.
15 IRQB O Open-drain output interrupt pin. Refer to Section 5.11.4, IRQ: PMIC Interrupt Register, for definitions. For programming, this pin must be supplied with a stable 7-V supply to burn the OTP memory. Recommend bypassing to ground with a 1-µF (typical) ceramic capacitor. Do not back-drive any pull-up on this output if programming.(1)
16 GPO1 O General purpose output that can be configured to either open-drain or push-pull arrangement. Regardless of the configuration, the pin can be programmed either to reflect Power Good status of VRs of any choice or to be controlled by an I2C register bit by the user, which then can be used as an enable signal to an external VR.
26 GPO2 O General purpose output that can be configured to either open-drain or push-pull arrangement. Regardless of the configuration, the pin can be programmed either to reflect Power Good status of VRs of any choice or to be controlled by an I2C register bit by the user, which then can be used as an enable signal to an external VR.
27 GPO3 O General purpose output that can be configured to either open-drain or push-pull arrangement. Regardless of the configuration, the pin can be programmed either to reflect Power Good status of VRs of any choice or to be controlled by an I2C register bit by the user, which then can be used as an enable signal to an external VR.
28 GPO4 O Open-drain output that can be configured to reflect Power Good status of VRs of any choice or to be controlled by an I2C register bit by the user, which then can be used as an enable signal to an external VR.
58 CLK I I2C clock
59 DATA I/O I2C data
60 CTL2 I Active-high VR enable pin. A group of VRs can be assigned to be enabled at assertion or disabled at deassertion of this pin.
61 CTL3/SLPENB1 I Active-high VR enable pin. A group of VRs can be assigned to be enabled at assertion or disabled at deassertion of this pin. Alternatively, when configured to active-low sleep enable, a group of VRs chosen can be entered into (L) or out of (H) sleep state where their output voltages may be different from those in normal state.
62 CTL4 I Active-high VR enable pin. A group of VRs can be assigned to be enabled at assertion or disabled at deassertion of this pin. For programming, this pin must be supplied with a stable 7-V supply to enter the programming state. Because of this requirement, CTL4 is generally not used to enable or disable regulators for the TPS650861 to avoid enabling rails during programming or damaging devices connected to CTL4. No bypass capacitor is needed for this pin.(1)
63 CTL5 I Active-high VR enable pin. A group of VRs can be assigned to be enabled at assertion or disabled at deassertion of this pin.
REFERENCE
52 AGND — Analog ground. Do not connect to the thermal pad ground on top layer. Connect to ground of VREF capacitor.
53 VREF O Band-gap reference output. Stabilize it by connecting a 100-nF (typical) ceramic capacitor between this pin and quiet ground.
55 VSYS I System voltage detection and input to internal LDOs (3.3 V and 5 V). Bypass to ground with a 1-µF (typical) ceramic capacitor.
THERMAL PAD
— Thermal pad (PGND) — Connect to PCB ground plane using multiple vias for good thermal and electrical performance.
(1) Ambient temperature must remain below 50 °C during programming, total time must be less than one minute.