SLDS187A October   2018  – December 2019 TPS65216

PRODUCTION DATA.  

  1. Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Simplified Schematic
  2. Revision History
  3. Pin Configuration and Functions
    1. 3.1 Pin Functions
      1.      Pin Functions
  4. Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Timing Requirements
    7. 4.7 Typical Characteristics
  5. Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Feature Description
      1. 5.3.1 Wake-Up and Power-Up and Power-Down Sequencing
        1. 5.3.1.1  Power-Up Sequencing
        2. 5.3.1.2  Power-Down Sequencing
        3. 5.3.1.3  Strobe 1 and Strobe 2
        4. 5.3.1.4  Supply Voltage Supervisor and Power-Good (PGOOD)
        5. 5.3.1.5  Internal LDO (INT_LDO)
        6. 5.3.1.6  Current Limited Load Switch
        7. 5.3.1.7  LDO1
        8. 5.3.1.8  UVLO
        9. 5.3.1.9  Power-Fail Comparator
        10. 5.3.1.10 DCDC3 and DCDC4 Power-Up Default Selection
        11. 5.3.1.11 I/O Configuration
          1. 5.3.1.11.1 Using GPIO2 as Reset Signal to DCDC1 and DCDC2
        12. 5.3.1.12 Push Button Input (PB)
          1. 5.3.1.12.1 Signaling PB-Low Event on the nWAKEUP Pin
          2. 5.3.1.12.2 Push Button Reset
        13. 5.3.1.13 AC_DET Input (AC_DET)
        14. 5.3.1.14 Interrupt Pin (INT)
        15. 5.3.1.15 I2C Bus Operation
    4. 5.4 Device Functional Modes
      1. 5.4.1 Modes of Operation
      2. 5.4.2 OFF
      3. 5.4.3 ACTIVE
      4. 5.4.4 SUSPEND
      5. 5.4.5 RESET
    5. 5.5 Register Maps
      1. 5.5.1 Password Protection
      2. 5.5.2 FLAG Register
      3. 5.5.3 TPS65216 Registers
        1. 5.5.3.1  CHIPID Register (subaddress = 0x00) [reset = 0x05]
          1. Table 5-7 CHIPID Register Field Descriptions
        2. 5.5.3.2  INT1 Register (subaddress = 0x01) [reset = 0x00]
          1. Table 5-8 INT1 Register Field Descriptions
        3. 5.5.3.3  INT2 Register (subaddress = 0x02) [reset = 0x00]
          1. Table 5-9 INT2 Register Field Descriptions
        4. 5.5.3.4  INT_MASK1 Register (subaddress = 0x03) [reset = 0x00]
          1. Table 5-10 INT_MASK1 Register Field Descriptions
        5. 5.5.3.5  INT_MASK2 Register (subaddress = 0x04) [reset = 0x00]
          1. Table 5-11 INT_MASK2 Register Field Descriptions
        6. 5.5.3.6  STATUS Register (subaddress = 0x05) [reset = 00XXXXXXb]
          1. Table 5-12 STATUS Register Field Descriptions
        7. 5.5.3.7  CONTROL Register (subaddress = 0x06) [reset = 0x00]
          1. Table 5-13 CONTROL Register Field Descriptions
        8. 5.5.3.8  FLAG Register (subaddress = 0x07) [reset = 0x00]
          1. Table 5-14 FLAG Register Field Descriptions
        9. 5.5.3.9  PASSWORD Register (subaddress = 0x10) [reset = 0x00]
          1. Table 5-15 PASSWORD Register Field Descriptions
        10. 5.5.3.10 ENABLE1 Register (subaddress = 0x11) [reset = 0x00]
          1. Table 5-16 ENABLE1 Register Field Descriptions
        11. 5.5.3.11 ENABLE2 Register (subaddress = 0x12) [reset = 0x00]
          1. Table 5-17 ENABLE2 Register Field Descriptions
        12. 5.5.3.12 CONFIG1 Register (subaddress = 0x13) [reset = 0x4C]
          1. Table 5-18 CONFIG1 Register Field Descriptions
        13. 5.5.3.13 CONFIG2 Register (subaddress = 0x14) [reset = 0xC0]
          1. Table 5-19 CONFIG2 Register Field Descriptions
        14. 5.5.3.14 CONFIG3 Register (subaddress = 0x15) [reset = 0x0]
          1. Table 5-20 CONFIG3 Register Field Descriptions
        15. 5.5.3.15 DCDC1 Register (offset = 0x16) [reset = 0x99]
          1. Table 5-21 DCDC1 Register Field Descriptions
        16. 5.5.3.16 DCDC2 Register (subaddress = 0x17) [reset = 0x99]
          1. Table 5-22 DCDC2 Register Field Descriptions
        17. 5.5.3.17 DCDC3 Register (subaddress = 0x18) [reset = 0x8C]
          1. Table 5-23 DCDC3 Register Field Descriptions
        18. 5.5.3.18 DCDC4 Register (subaddress = 0x19) [reset = 0xB2]
          1. Table 5-24 DCDC4 Register Field Descriptions
        19. 5.5.3.19 SLEW Register (subaddress = 0x1A) [reset = 0x06]
          1. Table 5-25 SLEW Register Field Descriptions
        20. 5.5.3.20 LDO1 Register (subaddress = 0x1B) [reset = 0x1F]
          1. Table 5-26 LDO1 Register Field Descriptions
        21. 5.5.3.21 SEQ1 Register (subaddress = 0x20) [reset = 0x00]
          1. Table 5-27 SEQ1 Register Field Descriptions
        22. 5.5.3.22 SEQ2 Register (subaddress = 0x21) [reset = 0x00]
          1. Table 5-28 SEQ2 Register Field Descriptions
        23. 5.5.3.23 SEQ3 Register (subaddress = 0x22) [reset = 0x98]
          1. Table 5-29 SEQ3 Register Field Descriptions
        24. 5.5.3.24 SEQ4 Register (subaddress = 0x23) [reset = 0x75]
          1. Table 5-30 SEQ4 Register Field Descriptions
        25. 5.5.3.25 SEQ5 Register (subaddress = 0x24) [reset = 0x12]
          1. Table 5-31 SEQ5 Register Field Descriptions
        26. 5.5.3.26 SEQ6 Register (subaddress = 0x25) [reset = 0x63]
          1. Table 5-32 SEQ6 Register Field Descriptions
        27. 5.5.3.27 SEQ7 Register (subaddress = 0x26) [reset = 0x03]
          1. Table 5-33 SEQ7 Register Field Descriptions
  6. Application and Implementation
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Design Requirements
      2. 6.2.2 Detailed Design Procedure
        1. 6.2.2.1 Output Filter Design
        2. 6.2.2.2 Inductor Selection for Buck Converters
        3. 6.2.2.3 Output Capacitor Selection
      3. 6.2.3 Application Curves
  7. Power Supply Recommendations
  8. Layout
    1. 8.1 Layout Guidelines
    2. 8.2 Layout Example
  9. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Package Option Addendum
      1. 10.1.1 Packaging Information
      2. 10.1.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

SLEW Register (subaddress = 0x1A) [reset = 0x06]

SLEW is shown in Figure 5-43 and described in Table 5-25.

Return to Summary Table.

NOTE

Slew-rate control applies to DCDC1 and DCDC2 only. If changing from a higher voltage to lower voltage while STRICT = 1 and converters are in a no load state, PFM bit for DCDC1 and DCDC2 must be set to 0.

Figure 5-43 SLEW Register
7 6 5 4 3 2 1 0
GO GODSBL RESERVED SLEW
R/W-0b R/W-0b R-000b R/W-6h

Table 5-25 SLEW Register Field Descriptions

Bit Field Type Reset Description
7 GO R/W 0b

Go bit. Note: Bit is automatically reset at the end of the voltage transition.

0b = No change

1b = Initiates the transition from present state to the output voltage setting currently stored in DCDC1 and DCDC2 register. SLEW setting does apply.

6 GODSBL R/W 0b

Go disable bit

0b = Enabled

1b = Disabled; DCDC1 and DCDC2 output voltage changes whenever set-point is updated in DCDC1 and DCDC2 register without having to write to the GO bit. SLEW setting does apply.

5-3 RESERVED R 000b

2-0 SLEW R/W 6h

Output slew rate setting:

0h = 160 µs/step (0.0625 mV/µs at 10 mV per step)

1h = 80 µs/step (0.125 mV/µs at 10 mV per step)

2h = 40 µs/step (0.250 mV/µs at 10 mV per step)

3h = 20 µs/step (0.500 mV/µs at 10 mV per step)

4h = 10 µs/step (1.0 mV/µs at 10 mV per step)

5h = 5 µs/step (2.0 mV/µs at 10 mV per step)

6h = 2.5 µs/step (4.0 mV/µs at 10 mV per step)

7h = Immediate; slew rate is only limited by control loop response time. Note: The actual slew rate depends on the voltage step per code. Refer to DCDCx registers for details.