SLVSCO4D July   2015  – February 2019 TPS65917-Q1

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Diagram
  2. 2Revision History
  3. 3Pin Configuration and Functions
    1. 3.1 Pin Attributes
      1.      Pin Attributes
    2. 3.2 Signal Descriptions
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Information
    5. 4.5  Electrical Characteristics — LDO Regulators
    6. 4.6  Electrical Characteristics — SMPS1&2 in Dual-Phase Configuration
    7. 4.7  Electrical Characteristics — SMPS1, SMPS2, SMPS3, SMPS4, and SMPS5 Stand-Alone Regulators
    8. 4.8  Electrical Characteristics — Reference Generator (Bandgap)
    9. 4.9  Electrical Characteristics — 32-kHz RC Oscillators and SYNCCLKOUT Output Buffers
    10. 4.10 Electrical Characteristics — 12-Bit Sigma-Delta ADC
    11. 4.11 Electrical Characteristics — Thermal Monitoring and Shutdown
    12. 4.12 Electrical Characteristics — System Control Thresholds
    13. 4.13 Electrical Characteristics — Current Consumption
    14. 4.14 Electrical Characteristics — Digital Input Signal Parameters
    15. 4.15 Electrical Characteristics — Digital Output Signal Parameters
    16. 4.16 I/O Pullup and Pulldown Characteristics
    17. 4.17 Electrical Characteristics — I2C Interface
    18. 4.18 Timing Requirements — I2C Interface
    19. 4.19 Timing Requirements — SPI
    20. 4.20 Switching Characteristics — LDO Regulators
    21. 4.21 Switching Characteristics — SMPS1&2 in Dual-Phase Configuration
    22. 4.22 Switching Characteristics — SMPS1, SMPS2, SMPS3, SMPS4, and SMPS5 Stand-Alone Regulators
    23. 4.23 Switching Characteristics — Reference Generator (Bandgap)
    24. 4.24 Switching Characteristics — PLL for SMPS Clock Generation
    25. 4.25 Switching Characteristics — 32-kHz RC Oscillators and SYNCCLKOUT Output Buffers
    26. 4.26 Switching Characteristics — 12-Bit Sigma-Delta ADC
    27. 4.27 Typical Characteristics
  5. 5Detailed Description
    1. 5.1  Overview
    2. 5.2  Functional Block Diagram
    3. 5.3  Device State Machine
      1. 5.3.1  Embedded Power Controller
      2. 5.3.2  State Transition Requests
        1. 5.3.2.1 ON Requests
        2. 5.3.2.2 OFF Requests
        3. 5.3.2.3 SLEEP and WAKE Requests
      3. 5.3.3  Power Sequences
      4. 5.3.4  Device Power Up Timing
      5. 5.3.5  Power-On Acknowledge
        1. 5.3.5.1 POWERHOLD Mode
        2. 5.3.5.2 AUTODEVON Mode
      6. 5.3.6  BOOT Configuration
        1. 5.3.6.1 Boot Pin Usage and Connection
      7. 5.3.7  Reset Levels
      8. 5.3.8  INT
      9. 5.3.9  Warm Reset
      10. 5.3.10 RESET_IN
    4. 5.4  Power Resources (Step-Down and Step-Up SMPS Regulators, LDOs)
      1. 5.4.1 Step-Down Regulators
        1. 5.4.1.1 Output Voltage and Mode Selection
        2. 5.4.1.2 Clock Generation for SMPS
        3. 5.4.1.3 Current Monitoring and Short Circuit Detection
        4. 5.4.1.4 POWERGOOD
        5. 5.4.1.5 DVS-Capable Regulators
          1. 5.4.1.5.1 Non DVS-Capable Regulators
        6. 5.4.1.6 Step-Down Converters SMPS1, SMPS2 or SMPS1&2
        7. 5.4.1.7 Step-Down Converters SMPS3, SMPS4, and SMPS5
      2. 5.4.2 Low Dropout Regulators (LDOs)
        1. 5.4.2.1 LDOVANA
        2. 5.4.2.2 LDOVRTC
        3. 5.4.2.3 LDO1 and LDO2
        4. 5.4.2.4 Low-Noise LDO (LDO5)
        5. 5.4.2.5 Other LDOs
    5. 5.5  SMPS and LDO Input Supply Connections
    6. 5.6  First Supply Detection
    7. 5.7  Long-Press Key Detection
    8. 5.8  12-Bit Sigma-Delta General-Purpose ADC (GPADC)
      1. 5.8.1 Asynchronous Conversion Request (SW)
      2. 5.8.2 Periodic Conversion (AUTO)
      3. 5.8.3 Calibration
    9. 5.9  General-Purpose I/Os (GPIO Pins)
    10. 5.10 Thermal Monitoring
      1. 5.10.1 Hot-Die Function (HD)
      2. 5.10.2 Thermal Shutdown
    11. 5.11 Interrupts
    12. 5.12 Control Interfaces
      1. 5.12.1 I2C Interfaces
        1. 5.12.1.1 I2C Implementation
        2. 5.12.1.2 F/S Mode Protocol
        3. 5.12.1.3 HS Mode Protocol
      2. 5.12.2 Serial Peripheral Interface (SPI)
        1. 5.12.2.1 SPI Modes
        2. 5.12.2.2 SPI Protocol
    13. 5.13 OTP Configuration Memory
    14. 5.14 Watchdog Timer (WDT)
    15. 5.15 System Voltage Monitoring
    16. 5.16 Register Map
      1. 5.16.1 Functional Register Mapping
    17. 5.17 Device Identification
  6. 6Applications, Implementation, and Layout
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Design Requirements
      2. 6.2.2 Detailed Design Procedure
        1. 6.2.2.1 SMPS Input Capacitors
        2. 6.2.2.2 SMPS Output Capacitors
        3. 6.2.2.3 SMPS Inductors
        4. 6.2.2.4 LDO Input Capacitors
        5. 6.2.2.5 LDO Output Capacitors
        6. 6.2.2.6 VCCA
          1. 6.2.2.6.1 Meeting the Power-Down Sequence
          2. 6.2.2.6.2 Maintaining Sufficient Input Voltage
        7. 6.2.2.7 VIO_IN
        8. 6.2.2.8 GPADC
      3. 6.2.3 Application Curves
    3. 6.3 Layout
      1. 6.3.1 Layout Guidelines
      2. 6.3.2 Layout Example
    4. 6.4 Power Supply Coupling and Bulk Capacitors
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Third-Party Products Disclaimer
      2. 7.1.2 Device Nomenclature
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation
    3. 7.3 Receiving Notification of Documentation Updates
    4. 7.4 Community Resources
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3.2.3 SLEEP and WAKE Requests

The device transitions from the ACTIVE to the SLEEP state after receiving a SLEEP request. Upon this request, internal resources as well as user-defined resources will enter the low-power mode as predefined by the user. The states of the resources during ACTIVE and SLEEP states are defined in the LDO*_CTRL and SMPSx_CTRL registers.

Table 5-4 lists the SLEEP requests. Any of theses events trigger the ACT2SLP sequence unless pending interrupts (unmasked) are present. Once the device enters the SLEEP state, only an interrupt or an NSLEEP signal can generate a WAKE request to wake up the device (exit from the SLEEP state). A WAKE request (only during the SLEEP state) wakes up the device and triggers a SLP2ACT or a SLP2OFF power sequence.

Table 5-4 SLEEP Requests

EVENT MASKABLE POLARITY COMMENT
NSLEEP (pin) Yes (Default: Masked) Low Level sensitive

For each resource, a transition from the ACTIVE state to the SLEEP state or from the SLEEP state to the ACTIVE state is controlled in two different ways which are described as follows:

  • Through EPC sequencing (ACT2SLP or SLP2ACT power sequence) when the resource is associated to the NSLEEP signal.
  • Through direct control of the resource power mode (ACTIVE or SLEEP) in which case the user can bypass SLEEP and WAKE sequencing by having resources assigned to two external control signals (ENABLE1 and ENABLE2). These signals have a direct control on the power modes (ACTIVE or SLEEP) of any resources associated to them and they trigger an immediate switch from one mode to the other, regardless of the EPC sequencing.

Therefore, all resources can be associated to three external pins (NSLEEP, ENABLE1, and ENABLE2) and can switch between the SLEEP and ACTIVE states. Table 5-5 outlines the type of state transition each resource undergoes according to the logic combination of the NSLEEP, ENABLE1 and ENABLE2 assignments.

Table 5-5 Resources SLEEP and ACTIVE Assignments(1)

ENABLE1 ASSIGNMENT ENABLE2 ASSIGNMENT NSLEEP ASSIGNMENT ENABLE1 PIN STATE ENABLE2 PIN STATE NSLEEP PIN STATE STATE TRANSITION
0 0 0 Don't care Don't care Don't care ACTIVE None
0 0 1 Don't care Don't care 0 ↔ 1 SLEEP ↔ ACTIVE Sequenced
0 1 0 Don't care 0 ↔ 1 Don't care SLEEP ↔ ACTIVE Immediate
0 1 1 Don't care 0 0 ↔ 1 SLEEP ↔ ACTIVE Sequenced
1 0 ↔ 1 ACTIVE None
0 ↔ 1 0 SLEEP ↔ ACTIVE Immediate
0 ↔ 1 1 ACTIVE None
1 0 0 0 ↔ 1 Don't care Don't care SLEEP ↔ ACTIVE Immediate
1 0 1 0 Don't care 0 ↔ 1 SLEEP ↔ ACTIVE Sequenced
1 0 ↔ 1 ACTIVE None
0 ↔ 1 0 SLEEP ↔ ACTIVE Immediate
0 ↔ 1 1 ACTIVE None
1 1 0 0 0 ↔ 1 Don't care SLEEP ↔ ACTIVE Immediate
1 0 ↔ 1 ACTIVE None
0 ↔ 1 0 SLEEP ↔ ACTIVE Immediate
0 ↔ 1 1 ACTIVE None
1 1 1 0 0 0 ↔ 1 SLEEP ↔ ACTIVE Sequenced
0 1 0 ↔ 1 ACTIVE None
1 0 0 ↔ 1 ACTIVE None
1 1 0 ↔ 1 ACTIVE None
0 0 ↔ 1 0 SLEEP ↔ ACTIVE Immediate
0 0 ↔ 1 1 ACTIVE None
1 0 ↔ 1 0 ACTIVE None
1 0 ↔ 1 1 ACTIVE None
0 ↔ 1 0 0 SLEEP ↔ ACTIVE Immediate
0 ↔ 1 0 1 ACTIVE None
0 ↔ 1 1 0 ACTIVE None
0 ↔ 1 1 1 ACTIVE None
  1. Notes:
    • The polarity of the NSLEEP, ENABLE1, and ENABLE2 signals is configurable through the POLARITY_CTRL register. By default:
      • ENABLE1 and ENABLE2 are active high, meaning a transition from 0 to 1 requests a transition from SLEEP state to ACTIVE state.
      • NSLEEP is active low, meaning a transition from 1 to 0 requests a transition from ACTIVE state to SLEEP state.
    • Resource assignments to the NSLEEP, ENABLE1, and ENABLE2 signals are configured in the ENABLEx_YYY_ASSIGN and NSLEEP_YYY_ASSIGN registers (where x = 1 or 2 and YYY = RES, SMPS, or LDO).
    • Several resources can be assigned to the same ENABLE signal (ENABLE1 or ENABLE2) and therefore, when triggered, they all switch their power mode at the same time.
    • When resources are assigned only to the NSLEEP signal, the respective switching order is controlled and defined in the power sequence.
    • When a resource is not assigned to any signal (NSLEEP, ENABLE1, or ENABLE2), it never switches from the ACTIVE state to the SLEEP state. The resource always remains in ACTIVE mode.