SLVSD02D March   2015  – June 2019 TPS65982

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Simplified Diagram
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
    1.     Legend for Pinout Drawing
    2.     Pin Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Supply Requirements and Characteristics
    6. 7.6  Power Supervisor Characteristics
    7. 7.7  Power Consumption Characteristics
    8. 7.8  Cable Detection Characteristics
    9. 7.9  USB-PD Baseband Signal Requirements and Characteristics
    10. 7.10 USB-PD TX Driver Voltage Adjustment Parameter
    11. 7.11 Port Power Switch Characteristics
    12. 7.12 Port Data Multiplexer Switching Characteristics
    13. 7.13 Port Data Multiplexer Clamp Characteristics
    14. 7.14 Port Data Multiplexer SBU Detection Characteristics
    15. 7.15 Port Data Multiplexer Signal Monitoring Pullup and Pulldown Characteristics
    16. 7.16 Port Data Multiplexer USB Endpoint Characteristics
    17. 7.17 Port Data Multiplexer BC1.2 Detection Characteristics
    18. 7.18 Analog-to-Digital Converter (ADC) Characteristics
    19. 7.19 Input/Output (I/O) Characteristics
    20. 7.20 I2C Slave Characteristics
    21. 7.21 SPI Master Characteristics
    22. 7.22 BUSPOWERZ Configuration Characteristics
    23. 7.23 Thermal Shutdown Characteristics
    24. 7.24 Oscillator Characteristics
    25. 7.25 Single-Wire Debugger (SWD) Timing Requirements
    26. 7.26 HPD Timing Requirements
    27. 7.27 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  USB-PD Physical Layer
        1. 9.3.1.1 USB-PD Encoding and Signaling
        2. 9.3.1.2 USB-PD Bi-Phase Marked Coding
        3. 9.3.1.3 USB-PD Transmit (TX) and Receive (Rx) Masks
        4. 9.3.1.4 USB-PD BMC Transmitter
        5. 9.3.1.5 USB-PD BMC Receiver
      2. 9.3.2  Cable Plug and Orientation Detection
        1. 9.3.2.1 Configured as a DFP
        2. 9.3.2.2 Configured as a UFP
        3. 9.3.2.3 Dead-Battery or No-Battery Support
      3. 9.3.3  Port Power Switches
        1. 9.3.3.1  5V Power Delivery
        2. 9.3.3.2  5V Power Switch as a Source
        3. 9.3.3.3  PP_5V0 Current Sense
        4. 9.3.3.4  PP_5V0 Current Limit
        5. 9.3.3.5  Internal HV Power Delivery
        6. 9.3.3.6  Internal HV Power Switch as a Source
        7. 9.3.3.7  Internal HV Power Switch as a Sink
        8. 9.3.3.8  Internal HV Power Switch Current Sense
        9. 9.3.3.9  Internal HV Power Switch Current Limit
        10. 9.3.3.10 External HV Power Delivery
        11. 9.3.3.11 External HV Power Switch as a Source with RSENSE
        12. 9.3.3.12 External HV Power Switch as a Sink with RSENSE
        13. 9.3.3.13 External HV Power Switch as a Sink without RSENSE
        14. 9.3.3.14 External Current Sense
        15. 9.3.3.15 External Current Limit
        16. 9.3.3.16 Soft Start
        17. 9.3.3.17 BUSPOWERZ
        18. 9.3.3.18 Voltage Transitions on VBUS through Port Power Switches
        19. 9.3.3.19 HV Transition to PP_RV0 Pull-Down on VBUS
        20. 9.3.3.20 VBUS Transition to VSAFE0V
        21. 9.3.3.21 C_CC1 and C_CC2 Power Configuration and Power Delivery
        22. 9.3.3.22 PP_CABLE to C_CC1 and C_CC2 Switch Architecture
        23. 9.3.3.23 PP_CABLE to C_CC1 and C_CC2 Current Limit
      4. 9.3.4  USB Type-C Port Data Multiplexer
        1. 9.3.4.1  USB Top and Bottom Ports
        2. 9.3.4.2  Multiplexer Connection Orientation
        3. 9.3.4.3  Digital Crossbar Multiplexer
        4. 9.3.4.4  SBU Crossbar Multiplexer
        5. 9.3.4.5  Signal Monitoring and Pullup/Pulldown
        6. 9.3.4.6  Port Multiplexer Clamp
        7. 9.3.4.7  USB2.0 Low-Speed Endpoint
        8. 9.3.4.8  Battery Charger (BC1.2) Detection Block
        9. 9.3.4.9  BC1.2 Data Contact Detect
        10. 9.3.4.10 BC1.2 Primary and Secondary Detection
      5. 9.3.5  Power Management
        1. 9.3.5.1 Power-On and Supervisory Functions
        2. 9.3.5.2 Supply Switch-Over
        3. 9.3.5.3 RESETZ and MRESET
      6. 9.3.6  Digital Core
      7. 9.3.7  USB-PD BMC Modem Interface
      8. 9.3.8  System Glue Logic
      9. 9.3.9  Power Reset Congrol Module (PRCM)
      10. 9.3.10 Interrupt Monitor
      11. 9.3.11 ADC Sense
      12. 9.3.12 UART
      13. 9.3.13 I2C Slave
      14. 9.3.14 SPI Master
      15. 9.3.15 Single-Wire Debugger Interface
      16. 9.3.16 DisplayPort HPD Timers
      17. 9.3.17 ADC
        1. 9.3.17.1 ADC Divider Ratios
        2. 9.3.17.2 ADC Operating Modes
        3. 9.3.17.3 Single Channel Readout
        4. 9.3.17.4 Round Robin Automatic Readout
        5. 9.3.17.5 One Time Automatic Readout
      18. 9.3.18 I/O Buffers
        1. 9.3.18.1 IOBUF_GPIOLS and IOBUF_GPIOLSI2C
        2. 9.3.18.2 IOBUF_OD
        3. 9.3.18.3 IOBUF_UTX
        4. 9.3.18.4 IOBUF_URX
        5. 9.3.18.5 IOBUF_PORT
        6. 9.3.18.6 IOBUF_I2C
        7. 9.3.18.7 IOBUF_GPIOHSPI
        8. 9.3.18.8 IOBUF_GPIOHSSWD
      19. 9.3.19 Thermal Shutdown
      20. 9.3.20 Oscillators
    4. 9.4 Device Functional Modes
      1. 9.4.1 Boot Code
      2. 9.4.2 Initialization
      3. 9.4.3 I2C Configuration
      4. 9.4.4 Dead-Battery Condition
      5. 9.4.5 Application Code
      6. 9.4.6 Flash Memory Read
      7. 9.4.7 Invalid Flash Memory
      8. 9.4.8 UART Download
    5. 9.5 Programming
      1. 9.5.1 SPI Master Interface
      2. 9.5.2 I2C Slave Interface
        1. 9.5.2.1 I2C Interface Description
        2. 9.5.2.2 I2C Clock Stretching
        3. 9.5.2.3 I2C Address Setting
        4. 9.5.2.4 Unique Address Interface
        5. 9.5.2.5 I2C Pin Address Setting
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Fully-Featured USB Type-C and PD Charger Application
        1. 10.2.1.1 Design Requirements
          1. 10.2.1.1.1 External FET Path Components (PP_EXT and RSENSE)
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 TPS65982 External Flash
          2. 10.2.1.2.2 I2C (I2C), Debug Control (DEBUG_CTL), and Single-Wire De-bugger (SWD) Resistors
          3. 10.2.1.2.3 Oscillator (R_OSC) Resistor
          4. 10.2.1.2.4 VBUS Capacitor and Ferrite Bead
          5. 10.2.1.2.5 Soft Start (SS) Capacitor
          6. 10.2.1.2.6 USB Top (C_USB_T), USB Bottom (C_USB_B), and Sideband-Use (SBU) Connections
          7. 10.2.1.2.7 Port Power Switch (PP_EXT, PP_HV, PP_5V0, and PP_CABLE) Capacitors
          8. 10.2.1.2.8 Cable Connection (CCn) Capacitors and RPD_Gn Connections
          9. 10.2.1.2.9 LDO_3V3, LDO_1V8A, LDO_1V8D, LDO_BMC, VOUT_3V3, VIN_3V3, and VDDIO
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Dual-Port Notebook Application Supporting USB PD Charging and DisplayPort
        1. 10.2.2.1 Design Requirements
          1. 10.2.2.1.1 Source Power Delivery Profiles for Type-C Ports
          2. 10.2.2.1.2 Sink Power Delivery Profile for Type-C Ports
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 TPS65982 and System Controller Interaction
          2. 10.2.2.2.2 HD3SS460 Control and DisplayPort Configuration
          3. 10.2.2.2.3 9.3.2.3 DC Barrel Jack and Type-C PD Charging
          4. 10.2.2.2.4 Primary TPS65982 Flash Master and Secondary Port
          5. 10.2.2.2.5 TPS65982 Dead Battery Support Primary and Secondary Port
          6. 10.2.2.2.6 Debugging Methods
        3. 10.2.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 3.3-V Power
      1. 11.1.1 VIN_3V3 Input Switch
      2. 11.1.2 VOUT_3V3 Output Switch
      3. 11.1.3 VBUS 3.3-V LDO
    2. 11.2 1.8 V Core Power
      1. 11.2.1 1.8 V Digital LDO
      2. 11.2.2 1.8 V Analog LDO
    3. 11.3 VDDIO
      1. 11.3.1 Recommended Supply Load Capacitance
      2. 11.3.2 Schottky for Current Surge Protection
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1  TPS65982 Recommended Footprints
        1. 12.1.1.1 Standard TPS65982 Footprint (Circular Pads)
      2. 12.1.2  Alternate TPS65982 Footprint (Oval Pads)
      3. 12.1.3  Top TPS65982 Placement and Bottom Component Placement and Layout
      4. 12.1.4  Oval Pad Footprint Layout and Placement
      5. 12.1.5  Component Placement
      6. 12.1.6  Designs Rules and Guidance
      7. 12.1.7  Routing PP_HV, PP_EXT, PP_5V0, and VBUS
      8. 12.1.8  Routing Top and Bottom Passive Components
      9. 12.1.9  Void Via Placement
      10. 12.1.10 Top Layer Routing
      11. 12.1.11 Inner Signal Layer Routing
      12. 12.1.12 Bottom Layer Routing
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

I2C Interface Description

The TPS65982 support Standard and Fast mode I2C interface. The bidirectional I2C bus consists of the serial clock (SCL) and serial data (SDA) lines. Both lines must be connected to a supply through a pullup resistor. Data transfer may be initiated only when the bus is not busy.

A master sending a Start condition, a high-to-low transition on the SDA input/output, while the SCL input is high initiates I2C communication. After the Start condition, the device address byte is sent, most significant bit (MSB) first, including the data direction bit (R/W).

After receiving the valid address byte, this device responds with an acknowledge (ACK), a low on the SDA input/output during the high of the ACK-related clock pulse. On the I2C bus, only one data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the high pulse of the clock period as changes in the data line at this time are interpreted as control commands (Start or Stop). The master sends a Stop condition, a low-to-high transition on the SDA input/output while the SCL input is high.

Any number of data bytes can be transferred from the transmitter to receiver between the Start and the Stop conditions. Each byte of eight bits is followed by one ACK bit. The transmitter must release the SDA line before the receiver can send an ACK bit. The device that acknowledges must pull down the SDA line during the ACK clock pulse, so that the SDA line is stable low during the high pulse of the ACK-related clock period. When a slave receiver is addressed, it must generate an ACK after each byte is received. Similarly, the master must generate an ACK after each byte that it receives from the slave transmitter. Setup and hold times must be met to ensure proper operation

A master receiver signals an end of data to the slave transmitter by not generating an acknowledge (NACK) after the last byte has been clocked out of the slave. The master receiver holding the SDA line high does this. In this event, the transmitter must release the data line to enable the master to generate a Stop condition.

Figure 70 shows the start and stop conditions of the transfer. Figure 71 shows the SDA and SCL signals for transferring a bit. Figure 72 shows a data transfer sequence with the ACK or NACK at the last clock pulse.

TPS65982 fig_65982_8p5_Prog_i2c_start_stop.gifFigure 70. I2C Definition of Start and Stop Conditions
TPS65982 fig_65982_8p5_Prog_i2c_bit_transfer.gifFigure 71. I2C Bit Transfer
TPS65982 fig_65982_8p5_Prog_i2c_bit_acknowledge.gifFigure 72. I2C Acknowledgment