SLVSD02D March 2015 – June 2019 TPS65982
Figure 87 shows the TPS65982 footprint using a 0.25mm pad diameter. This footprint is applicable to boards that will be using an HDI PCB process that uses smaller vias to fan-out into the inner layers of the PCB. This footprint requires via fill and tenting and is recommended for size-constrained applications. The circular footprint allows for easy fan-out into other layers of the PCB and better thermal dissipation into the GND planes. Figure 88 shows the recommended via sizing for use under the balls. The size is 5mil hole and 10mil diameter. This via size will allow for approximately 1.5A current rating at 3 mΩ of DC resistance with 1.6nH of inductance. It is recommended to verify these numbers with board manufacturing processes used in fabrication of the PCB. This footprint is available for download on the TPS65982 product folder on the TPS65982 product folder.