SLVSG37 June   2021 TPS65994AE

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Recommended Capacitance
    5. 6.5  Thermal Information
    6. 6.6  Power Supply Characteristics
    7. 6.7  Power Consumption
    8. 6.8  PP_5V Power Switch Characteristics
    9. 6.9  PP_EXT Power Switch Characteristics
    10. 6.10 Power Path Supervisory
    11. 6.11 CC Cable Detection Parameters
    12. 6.12 CC VCONN Parameters
    13. 6.13 CC PHY Parameters
    14. 6.14 Thermal Shutdown Characteristics
    15. 6.15 ADC Characteristics
    16. 6.16 Input/Output (I/O) Characteristics
    17. 6.17 I2C Requirements and Characteristics
    18. 6.18 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  USB-PD Physical Layer
        1. 8.3.1.1 USB-PD Encoding and Signaling
        2. 8.3.1.2 USB-PD Bi-Phase Marked Coding
        3. 8.3.1.3 USB-PD Transmit (TX) and Receive (Rx) Masks
        4. 8.3.1.4 USB-PD BMC Transmitter
        5. 8.3.1.5 USB-PD BMC Receiver
        6. 8.3.1.6 Squelch Receiver
      2. 8.3.2  Power Management
        1. 8.3.2.1 Power-On And Supervisory Functions
        2. 8.3.2.2 VBUS LDO
      3. 8.3.3  Power Paths
        1. 8.3.3.1 Internal Sourcing Power Paths
          1. 8.3.3.1.1  PP_5Vx Current Clamping
          2. 8.3.3.1.2  PP_5Vx Local Overtemperature Shut Down (OTSD)
          3. 8.3.3.1.3  PP_5Vx Current Sense
          4. 8.3.3.1.4  PP_5Vx OVP
          5. 8.3.3.1.5  PP_5Vx UVLO
          6. 8.3.3.1.6  PP_5Vx Reverse Current Protection
          7. 8.3.3.1.7  Fast Role Swap
          8. 8.3.3.1.8  PP_CABLE Current Clamp
          9. 8.3.3.1.9  PP_CABLE Local Overtemperature Shut Down (OTSD)
          10. 8.3.3.1.10 PP_CABLE UVLO
        2. 8.3.3.2 Sink Path Control
          1. 8.3.3.2.1 Overvoltage Protection (OVP)
          2. 8.3.3.2.2 Reverse-Current Protection (RCP)
          3. 8.3.3.2.3 VBUS UVLO
          4. 8.3.3.2.4 Discharging VBUS to Safe Voltage
      4. 8.3.4  Cable Plug and Orientation Detection
        1. 8.3.4.1 Configured as a Source
        2. 8.3.4.2 Configured as a Sink
        3. 8.3.4.3 Configured as a DRP
        4. 8.3.4.4 Fast Role Swap Signal Detection
      5. 8.3.5  Default Behavior Configuration (ADCIN1, ADCIN2)
      6. 8.3.6  ADC
      7. 8.3.7  DisplayPort Hot-Plug Detect (HPD)
      8. 8.3.8  Digital Interfaces
        1. 8.3.8.1 General GPIO
        2. 8.3.8.2 I2C Interface
      9. 8.3.9  Digital Core
      10. 8.3.10 I2C Interface
        1. 8.3.10.1 I2C Interface Description
        2. 8.3.10.2 I2C Clock Stretching
        3. 8.3.10.3 I2C Address Setting
        4. 8.3.10.4 Unique Address Interface
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pin Strapping to Configure Default Behavior
      2. 8.4.2 Power States
      3. 8.4.3 Thermal Shutdown
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Type-C VBUS Design Considerations
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Type-C Connector VBUS Capacitors
          2. 9.2.1.2.2 VBUS Schottky and TVS Diodes
          3. 9.2.1.2.3 VBUS Snubber Circuit
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Notebook Design Supporting PD Charging
        1. 9.2.2.1 USB and DisplayPort notebook Supporting PD Charging
          1. 9.2.2.1.1 Design Requirements
          2. 9.2.2.1.2 Detailed Design Procedure
            1. 9.2.2.1.2.1 USB Power Delivery Source Capabilities
            2. 9.2.2.1.2.2 USB Power Delivery Sink Capabilities
            3. 9.2.2.1.2.3 USB and DisplayPort Supported Data Modes
            4. 9.2.2.1.2.4 TUSB1046 Super Speed Mux GPIO Control
        2. 9.2.2.2 Thunderbolt Notebook Supporting PD Charging
          1. 9.2.2.2.1 Design Requirements
          2. 9.2.2.2.2 Detailed Design Procedure
            1. 9.2.2.2.2.1 USB Power Delivery Source Capabilities
            2. 9.2.2.2.2.2 USB Power Delivery Sink Capabilities
            3. 9.2.2.2.2.3 Thunderbolt Supported Data Modes
            4. 9.2.2.2.2.4 I2C Design Requirements
            5. 9.2.2.2.2.5 TS3DS10224 SBU Mux for AUX and LSTX/RX
  10. 10Power Supply Recommendations
    1. 10.1 3.3-V Power
      1. 10.1.1 VIN_3V3 Input Switch
      2. 10.1.2 VBUS 3.3-V LDO
    2. 10.2 1.5-V Power
    3. 10.3 Recommended Supply Load Capacitance
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Top TPS65994AE Placement and Bottom Component Placement and Layout
    2. 11.2 Layout Example
    3. 11.3 Component Placement
    4. 11.4 Routing PP_5V, VBUS, VIN_3V3, LDO_3V3, LDO_1V5
    5. 11.5 Routing CC and GPIO
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.5 Routing CC and GPIO

Routing the CC lines with a 10-mil trace will ensure the needed current for supporting powered Type-C cables through VCONN. For more information on VCONN refer to the Type-C specification. For capacitor GND pin use a 16-mil trace if possible.

Most of the GPIO signals can be fanned out on the top or bottom layer using either a 6-mil trace or a 8-mil trace. The following images highlight how the CC lines and GPIOs are routed out.

GUID-20200625-SS0I-TWPL-CQ98-SW6JZS6JP4TD-low.png Figure 11-9 Top Layer GPIO Routing
Table 11-1 Routing Widths
ROUTE WIDTH (mil minimum)
PA_CC1, PA_CC2, PB_CC1, PB_CC2 8
VIN_3V3, LDO_3V3, LDO_1V5 6
Component GND 10
GPIO 4