SLVSCE6C December   2013  – June 2018 TPS709-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Typical Application Circuit
      2.      GND Current vs VIN and Temperature
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Shutdown
      3. 7.3.3 Reverse Current Protection
      4. 7.3.4 Internal Current Limit
      5. 7.3.5 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Capacitor Considerations
      2. 8.1.2 Dropout Voltage
      3. 8.1.3 Transient Response
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance
      2. 10.1.2 Power Dissipation
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
  • DRV|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

At –40°C ≤ TJ, TA ≤ 125°C, VIN = VOUT(nom) + 1 V or 2.7 V (whichever is greater), IOUT = 1 mA, VEN = 2 V, and CIN = COUT = 2.2-μF ceramic, unless otherwise noted. Typical values are at TJ = 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage range 2.7 30 V
VOUT Output voltage range 1.2 6.5 V
VOUT DC output accuracy VOUT< 3.3 V –2% 2%
VOUT ≥ 3.3 V –1% 1%
ΔVOUT Line regulation (VOUT(nom) + 1 V, 2.7 V) ≤ VIN ≤ 30 V 3 10 mV
Load regulation VIN = VOUT(nom) + 1.5 V or 3 V (whichever is greater), 100 µA ≤ IOUT ≤ 150 mA 20 50 mV
VDO Dropout voltage(1)(3) TPS70933-Q1, IOUT = 50 mA 295 650 mV
TPS70933-Q1, IOUT = 150 mA 975 1540
TPS70950-Q1, IOUT = 50 mA 245 500
TPS70950-Q1, IOUT = 150 mA 690 1200
ICL Output current limit(4) VOUT = 0.9 × VOUT(nom) 200 320 500 mA
IGND Ground pin current IOUT = 0 mA, VOUT ≤ 3.3 V 1.3 2.55 µA
IOUT = 0 mA, VOUT> 3.3 V 1.4 2.7
IOUT = 100 μA, VIN = 30 V 6.7 10
IOUT = 150 mA 350
ISHDN Shutdown current VEN ≤ 0.4 V, VIN = 2.7 V 150 nA
PSRR Power-supply rejection ratio f = 10 Hz 80 dB
f = 100 Hz 62
f = 1 kHz 52
Vn Output noise voltage BW = 10 Hz to 100 kHz, IOUT = 10 mA,
VIN = 2.7 V, VOUT = 1.2 V
190 μVRMS
VEN(HI) Enable pin high (enabled) 0.9 V
VEN(LO) Enable pin high (disabled) 0 0.4 V
IEN Enable pin current EN = 1.0 V, VIN = 5.5 V 300 nA
IREV Reverse current
(flowing out of IN pin)
VOUT = 3 V, VIN = VEN = 0 V 10 nA
Reverse current
(flowing into OUT pin)
VOUT = 3 V, VIN = VEN = 0 V 100 nA
TSD Thermal shutdown temperature Shutdown, temperature increasing 158 °C
Reset, temperature decreasing 140
TJ Operating junction temperature –40 125 °C
VDO is measured with VIN = 0.98 × VOUT(nom).
Startup time = time from EN assertion to 0.95 × VOUT(nom) and load = 47 Ω.
Dropout is only valid when VOUT ≥ 2.8 V because of the minimum input voltage limits.
Measured with VIN = VOUT + 3 V for VOUT ≤ 2.5 V. Measured with VIN = VOUT + 2.5 V for VOUT> 2.5 V.