SLVS338R May   2001  – April 2015 TPS715


  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Wide Supply Range
      2. 7.3.2 Low Supply Current
      3. 7.3.3 Stable With Any Capacitor ≥ 0.47 µF
      4. 7.3.4 Internal Current Limit
      5. 7.3.5 Reverse Current
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. Power the MSP430 Microcontroller
      2. 8.2.2 Detailed Design Procedure
        1. External Capacitor Requirements
        2. Dropout Voltage (VDO)
        3. Setting VOUT for the TPS71501 Adjustable LDO
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. Evaluation Module
        2. Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

For best overall performance, place all circuit components on the same side of the printed-circuit-board and as near as practical to the respective LDO pin connections. Place ground return connections for the input and output capacitors as close to the GND pin as possible, using wide, component-side, copper planes. TI strongly discourages using vias and long traces to create LDO circuit connections to the input capacitor, output capacitor, or the resistor divider because that will negatively affect system performance. This grounding and layout scheme minimizes inductive parasitics, and thereby reduces load-current transients, minimizes noise, and increases circuit stability. A ground reference plane is also recommended and is either embedded in the PCB itself or located on the bottom side of the PCB opposite the components. This reference plane serves to assure accuracy of the output voltage and shield the LDO from noise.

10.2 Layout Example

TPS715 Layout.gifFigure 17. Example Layout for TPS71501DCK

10.3 Power Dissipation

To ensure reliable operation, worst-case junction temperature should not exceed 125°C. This restriction limits the power dissipation the regulator can handle in any given application. To ensure the junction temperature is within acceptable limits, calculate the maximum allowable dissipation, PD(max), and the actual dissipation, PD, which must be less than or equal to PD(max).

The maximum-power-dissipation limit is determined using Equation 4:

Equation 4. TPS715 q_pdmax_rtja-lvs338.gif


  • TJmax is the maximum allowable junction temperature
  • RθJA is the thermal resistance junction-to-ambient for the package (see the Thermal Informationtable)
  • TA is the ambient temperature

The regulator dissipation is calculated using Equation 5:

Equation 5. TPS715 Q_pd_vi_vo-lvs338.gif

For a higher power package version of the TPS715, see the TPS715A.