SLVS338R May   2001  – April 2015 TPS715

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Wide Supply Range
      2. 7.3.2 Low Supply Current
      3. 7.3.3 Stable With Any Capacitor ≥ 0.47 µF
      4. 7.3.4 Internal Current Limit
      5. 7.3.5 Reverse Current
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power the MSP430 Microcontroller
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitor Requirements
        2. 8.2.2.2 Dropout Voltage (VDO)
        3. 8.2.2.3 Setting VOUT for the TPS71501 Adjustable LDO
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Module
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Q Revision (January 2014) to R Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed front-page figure Go
  • Changed Pin Configuration and Functions section; updated table format Go
  • Deleted Continuous total power dissipation row in Absolute Maximum RatingsGo

Changes from P Revision (November 2008) to Q Revision

  • Changed test condition for VOUT accuracy parameterGo