SBVS047H May   2004  – March 2016 TPS715A

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Wide Supply Range
      2. 7.3.2 Low Supply Current
      3. 7.3.3 Stable With Any Capacitor ≥ 0.47 µF
      4. 7.3.4 Internal Current Limit
      5. 7.3.5 Reverse Current
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application (Fixed-Voltage Version)
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Power the MSP430 Microcontroller
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 External Capacitor Requirements
          2. 8.2.1.2.2 Dropout Voltage (VDO)
        3. 8.2.1.3 Application Curves
      2. 8.2.2 TPS715A01 Adjustable LDO Regulator Programming
        1. 8.2.2.1 Detailed Design Procedure
          1. 8.2.2.1.1 Setting VOUT for the TPS715A01 Adjustable LDO
    3. 8.3 Do's and Don'ts
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Module
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from G Revision (May 2015) to H Revision

  • Changed third Applications bullet Go
  • Added package designators to Device Information table for clarity Go
  • Corrected pin numbers in Pin Functions table to align with pin out configurationsGo
  • Added parameter name to VIN row of Absolute Maximum Ratings tableGo
  • Deleted Dissipation Ratings table Go
  • Added last three items to Related Documentation Go

Changes from F Revision (October 2012) to G Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from E Revision (June 2011) to F Revision

  • Updated Figure 15.Go

Changes from D Revision (May, 2007) to E Revision

  • Added last Applications bulletGo
  • Added last sentence to Description sectionGo