SBVS037P August   2003  – December 2015 TPS732

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Output Noise
      2. 7.3.2 Internal Current Limit
      3. 7.3.3 Enable Pin and Shutdown
      4. 7.3.4 Dropout Voltage
      5. 7.3.5 Reverse Current
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation With 1.7 V ≤ VIN ≤ 5.5 V and VEN ≥ 1.7 V
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Transient Response
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Thermal Considerations
      1. 10.3.1 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from O Revision (August 2010) to P Revision

  • Changed Features bullet about NMOS topology; deleted "new"Go
  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed first paragraph of Description section; deleted description of NMOS topology as "new"Go
  • Changed Pin Configuration and Functions section; updated table format Go
  • Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statement Go
  • Changed Thermal Information table; updated thermal resistance values for all packages Go

Changes from N Revision (August, 2009) to O Revision

  • Replaced the Dissipation Ratings table with the Thermal Information tableGo

Changes from M Revision (May, 2008) to N Revision

  • Changed Figure 10 Go
  • Added paragraph about recommended start-up sequence to Internal Current Limit sectionGo
  • Added paragraph about current foldback and device start-up to Enable Pin and Shutdown sectionGo