SBVS067R January   2006  – December 2019 TPS737

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Circuit
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Output Noise
      2. 7.3.2 Internal Current Limit
      3. 7.3.3 Enable Pin and Shutdown
      4. 7.3.4 Reverse Current
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Dropout Voltage
        3. 8.2.2.3 Transient Response
      3. 8.2.3 Application Curves
    3. 8.3 What To Do and What Not To Do
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Power Dissipation
      2. 10.1.2 Thermal Protection
      3. 10.1.3 Estimating Junction Temperature
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Q Revision (May 2015) to R Revision

  • Changed WSON to VSON and VSON to WSON in header row of Pin Functions table Go
  • Changed unit from V to % in VOUT parameter of Electrical Characteristics table Go

Changes from P Revision (July 2013) to Q Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statement Go
  • Changed "free-air temperature" to "junction temperature" in Recommended Operating Conditions condition statement Go
  • Changed Internal Reference parameter (VFB) typical values from 1.2 V to 1.204 VGo

Changes from O Revision (June 2012) to P Revision

  • Added last paragraph to Description sectionGo

Changes from N Revision (June 2011) to O Revision

  • Changed Thermal Information table data and footnote 2bGo
  • Changed VFBInternal reference parameter in Electrical Characteristics tableGo
  • Changed title of Figure 6Go

Changes from M Revision (October, 2010) to N Revision

  • Added footnote (3) to Thermal Information tableGo
  • Added footnote to Figure 38Go

Changes from L Revision (August, 2010) to M Revision