SBVS074L January   2007  – March 2017


  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics IOUT = 50 mA
    7. 6.7 Typical Characteristics IOUT = 1 A
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable/Shutdown
      2. 7.3.2 Power Good
      3. 7.3.3 Internal Current Limit
      4. 7.3.4 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
    5. 7.5 Programming
      1. 7.5.1 Programmable Soft-Start
      2. 7.5.2 Sequencing Requirements
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjusting the Output Voltage
      2. 8.1.2 Input, Output, and Bias Capacitor Requirements
      3. 8.1.3 Transient Response
      4. 8.1.4 Dropout Voltage
      5. 8.1.5 Output Noise
    2. 8.2 Typical Applications
      1. 8.2.1 FPGA I/O Supply at 1.5 V With a Bias Rail
        1. Design Requirements
        2. Detailed Design Procedure
        3. Application Curves
      2. 8.2.2 FPGA I/O Supply at 1.5 V Without a Bias Rail
        1. Design Requirements
        2. Detailed Design Procedure
        3. Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Estimating Junction Temperature
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. Evaluation Modules
        2. Spice Models
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information


Layout Guidelines

An optimal layout can greatly improve transient performance, PSR, and noise. To minimize the voltage drop on the input of the device during load transients, the capacitance on IN and BIAS should be connected as close as possible to the device. This capacitance also minimizes the effects of parasitic inductance and resistance of the input source and can, therefore, improve stability. To achieve optimal transient performance and accuracy, the top side of R1 in Figure 24 should be connected as close as possible to the load. If BIAS is connected to IN, it is recommended to connect BIAS as close to the sense point of the input supply as possible. This connection minimizes the voltage drop on BIAS during transient conditions and can improve the turnon response.

Knowing the device power dissipation and proper sizing of the thermal plane that is connected to the thermal pad is critical to avoiding thermal shutdown and ensuring reliable operation. Power dissipation of the device depends on input voltage and load conditions and can be calculated using Equation 6:

Equation 6. TPS748 q_pd_bvs074.gif

Power dissipation can be minimized and greater efficiency can be achieved by using the lowest possible input voltage necessary to achieve the required output voltage regulation.

On both the VSON (DRC) and QFN (RGW) packages, the primary conduction path for heat is through the exposed pad to the printed circuit board (PCB). The pad can be connected to ground or be left floating; however, it should be attached to an appropriate amount of copper PCB area to ensure the device does not overheat. The maximum junction-to-ambient thermal resistance depends on the maximum ambient temperature, maximum device junction temperature, and power dissipation of the device and can be calculated using Equation 7:

Equation 7. TPS748 q_rja_bvs074.gif

Knowing the maximum RθJA, the minimum amount of PCB copper area needed for appropriate heatsinking can be estimated using Figure 36.

TPS748 ai_theta_ja_bvs074.gif


θJA value at board size of 9 in2 (that is, 3 in × 3i n) is a JEDEC standard.
Figure 36. ΘJA vs Board Size

Figure 36 shows the variation of θJA as a function of ground plane copper area in the board. It is intended only as a guideline to demonstrate the effects of heat spreading in the ground plane and should not be used to estimate actual thermal performance in real application environments.


When the device is mounted on an application PCB, TI strongly recommends using ΨJT and ΨJB, as explained in Estimating Junction Temperature.

Layout Example

TPS748 ai_20_RGW_layout.gif Figure 37. Layout Example (RGW Package)

Estimating Junction Temperature

Using the thermal metrics ΨJT and ΨJB, as shown in the Thermal Information table, the junction temperature can be estimated with corresponding formulas (given in Equation 8). For backwards compatibility, an older θJC,Top parameter is listed as well.

Equation 8. TPS748 q_new_metrics_bvs066.gif

Where PD is the power dissipation shown by Equation 6, TT is the temperature at the center-top of the IC package, and TB is the PCB temperature measured 1 mm away from the IC package on the PCB surface (Figure 38).


Both TT and TB can be measured on actual application boards using a thermo‐gun (an infrared thermometer).

For more information about measuring TT and TB, see the Using New Thermal Metrics application note, available for download at

TPS748 ai_thermal_measmt_bvs074.gif Figure 38. Measuring Points for TT and TB

By looking at Figure 39, the new thermal metrics (ΨJT and ΨJB) have very little dependency on board size. That is, using ΨJT or ΨJB with Equation 8 is a good way to estimate TJ by simply measuring TT or TB, regardless of the application board size.

TPS748 ai_psi_jt_jb_bvs074.gif Figure 39. ΨJT and ΨJB vs Board Size

For a more detailed discussion of why TI does not recommend using θJC(top) to determine thermal characteristics, see the Using New Thermal Metrics application report, available for download at For further information, see the IC Package Thermal Metrics application report, also available on the TI website.