SGLS247C September   2011  – December 2025 TPS763-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Output Pulldown
      5. 6.3.5 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Adjustable Device Feedback Resistors
      2. 7.1.2 Recommended Capacitor Types
        1. 7.1.2.1 Recommended Capacitors (Legacy Chip)
        2. 7.1.2.2 Recommended Capacitors (New Chip)
      3. 7.1.3 Input and Output Capacitor Requirements
        1. 7.1.3.1 Input Capacitor Requirements
        2. 7.1.3.2 Output Capacitor Requirements
      4. 7.1.4 Reverse Current
      5. 7.1.5 Feed-Forward Capacitor (CFF)
      6. 7.1.6 Power Dissipation (PD)
      7. 7.1.7 Estimating Junction Temperature
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Output Voltage Programming
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
      3. 7.4.3 Power Dissipation and Junction Temperature
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Device Nomenclature
      2. 8.2.2 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1.3.1 Input Capacitor Requirements

For legacy chip, although not required, a 0.047μF or larger ceramic bypass input capacitor, connected between IN and GND and located close to the TPS763xx-Q1, is recommended to improve transient response and noise rejection. A higher-value electrolytic input capacitor can be necessary if large, fast-rise-time load transients are anticipated and the device is located several inches from the power source.

Note:

Tantalum capacitors can suffer catastrophic failure because of surge current when connected to a low-impedance source of power (such as a battery or very large capacitor). If a tantalum capacitor is used at the input, contact the manufacturer to make sure the capacitor has a surge current rating sufficient for the application.

There are no requirements for ESR on the input capacitor, but consider tolerance and temperature coefficient when selecting the capacitor to make sure the capacitance is ≥ 1µF over the entire operating temperature range.

For new chip, although an input capacitor is not required for stability, good analog design practice is to connect a capacitor from IN to GND. This capacitor counteracts reactive input sources and improves transient response, input ripple, and PSRR. Use an input capacitor if the source impedance is more than 0.5Ω. A higher value capacitor can be necessary if large, fast rise-time load or line transients are anticipated or if the device is located several inches from the input power source.