SGLS247C September   2011  – December 2025 TPS763-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Output Pulldown
      5. 6.3.5 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Adjustable Device Feedback Resistors
      2. 7.1.2 Recommended Capacitor Types
        1. 7.1.2.1 Recommended Capacitors (Legacy Chip)
        2. 7.1.2.2 Recommended Capacitors (New Chip)
      3. 7.1.3 Input and Output Capacitor Requirements
        1. 7.1.3.1 Input Capacitor Requirements
        2. 7.1.3.2 Output Capacitor Requirements
      4. 7.1.4 Reverse Current
      5. 7.1.5 Feed-Forward Capacitor (CFF)
      6. 7.1.6 Power Dissipation (PD)
      7. 7.1.7 Estimating Junction Temperature
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Output Voltage Programming
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
      3. 7.4.3 Power Dissipation and Junction Temperature
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Device Nomenclature
      2. 8.2.2 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • AEC-Q100 Qualified for automotive applications:
    • Temperature Grade 1: –40°C to +150°C TJ (new chip)
    • Device HBM ESD Classification: Level 1C
    • Device CDM ESD Classification: Level C3 (legacy chip)
    • Device CDM ESD Classification: Level C4 (new chip)
  • Input voltage range VIN: 2.7V to 10V
  • Output voltage range VOUT:
    • Fixed device: 1.6V to 5.0V
  • Output voltage range VOUT:
    • Adjustable device: 1.6V to 6.5V
  • Output current: up-to 150mA
  • Output voltage accuracy:
    • New chip: ±1.5% (typical)
    • Legacy chip: ±2.5% (typical)
  • Low quiescent current IQ:
    • New chip: 65μA (typical) at IOUT = 0mA
    • New chip: 765μA (typical) at IOUT = 150mA
    • Legacy chip: 85μA (typical) at IOUT = 1mA to 150mA
  • Dropout voltage:
    • New chip: 175mV (typical) at IOUT = 150mA
    • Legacy chip: 300mV (typical) at IOUT = 150mA
  • Supported ESR range:
    • New chip: 0Ω to 1Ω
    • Legacy chip: 0.3Ω to 10Ω
  • Thermal shutdown and overcurrent limitation
  • Active over-shoot pulldown protection (new chip)
  • Operating junction temperature: –40°C to 150°C (new chip)
  • 5-pin SOT-23 (DBV):
    • New chip, RθJA = 178.6°C/W
    • Legacy chip, RθJA = 205.2°C/W