SLVS822E March   2009  – September 2015

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dissipation Ratings
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Adjustable Operation
      2. 7.3.2 Output Capacitance and Transient Response
      3. 7.3.3 Calculating Junction Temperature
      4. 7.3.4 Protection Features
    4. 7.4 Device Functional Modes
      1. 7.4.1 Low-Voltage Tracking
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Thermal Considerations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Power Supply Recommendations

9.1 Thermal Considerations

The power handling capability of the device is limited by the maximum rated junction temperature (125°C). The power dissipated by the device consists of two components:

  • Output current multiplied by the input/output voltage differential: IOUT × (VIN – VOUT)
  • GND pin current multiplied by the input voltage: IGND × VIN

The GND pin current can be found by examining the GND pin current curves in the Typical Characteristics. Power dissipation is equal to the sum of the two components listed previously.

The TPS798xx-Q1 series regulators have internal thermal limiting designed to protect the device during overload conditions. Do not exceed the maximum junction temperature rating of 125°C. It is important to carefully consider all sources of thermal resistance from junction to ambient. Additional heat sources mounted nearby must also be considered.

For surface-mount devices, heat sinking is accomplished by using the heat-spreading capabilities of the printed-circuit-board (PCB) and its copper traces. Copper board stiffeners and plated through-holes can also be used to spread the heat generated by power devices.