SBVS375B July   2019  – April 2020 TPS7A03

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Circuit
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions: DQN, DBV
    2.     Pin Functions: YCH
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Excellent Transient Response
      2. 7.3.2 Active Discharge (P-Version Only)
      3. 7.3.3 Low IQ in Dropout
      4. 7.3.4 Smart Enable
      5. 7.3.5 Dropout Voltage
      6. 7.3.6 Foldback Current Limit
      7. 7.3.7 Undervoltage Lockout (UVLO)
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Load Transient Response
      4. 8.1.4 Undervoltage Lockout (UVLO) Operation
      5. 8.1.5 Power Dissipation (PD)
        1. 8.1.5.1 Estimating Junction Temperature
        2. 8.1.5.2 Recommended Area for Continuous Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

DQN Package
1-mm × 1-mm, 4-pin X2SON
Top View
DBV Package
5-Pin SOT-23
Top View

Pin Functions: DQN, DBV

PIN I/O(1) DESCRIPTION
NAME DQN DBV
EN 3 3 Input Enable pin. Driving this pin to logic high enables the device; driving this pin to logic low or floating this pin disables the device. This pin features an internal pulldown resistor, which is disconnected when EN is driven high externally and the device has started up.
GND 2 2 — Ground pin. This pin must be connected to ground on the board.
IN 4 1 Input Input pin. For best transient response and to minimize input impedance, use the recommended value or larger ceramic capacitor from IN to ground; see the Recommended Operating Conditions table. Place the input capacitor as close to the input of the device as possible.
NC — 4 — No connect pin. This pin is not internally connected. Connect to ground or leave floating.
OUT 1 5 Output Regulated output pin. A 0.5-µF or greater effective capacitance is required from OUT to ground for stability. For best transient response, use a 1-µF or larger ceramic capacitor from OUT to ground. Place the output capacitor as close to output of the device as possible; see the Recommended Operating Conditions table.
Thermal pad –– — Connect the thermal pad to a large-area ground plane. The thermal pad is internally connect to ground.
(1) NC = No internal connection.
YCH Package (Preview)
4-Pin DSBGA, 0.35-mm Pitch
Top View
YCH Package (Preview)
4-Pin DSBGA, 0.35-mm Pitch
Bottom View

Pin Functions: YCH

PIN I/O DESCRIPTION
NAME YCH
EN B1 Input Enable pin. Driving this pin to logic high enables the device; driving this pin to logic low or floating this pin disables the device. This pin features an internal pulldown resistor, which is disconnected when EN is driven high externally and the device has started up.
GND B2 — Ground pin. This pin must be connected to ground and the thermal pad.
IN A1 Input Input pin. For best transient response and to minimize input impedance, use the recommended value or larger ceramic capacitor from IN to ground; see the Recommended Operating Conditions table. Place the input capacitor as close to input of the device as possible.
OUT A2 Output Regulated output pin. A 0.5-µF or greater effective capacitance is required from OUT to ground for stability. For best transient response, use a 1-µF or larger ceramic capacitor from OUT to ground. Place the output capacitor as close to output of the device as possible; see the Recommended Operating Conditions table.