SBVS338G March   2020  – May 2022 TPS7A20

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Low Output Noise
      2. 7.3.2 Smart Enable
      3. 7.3.3 Dropout Voltage
      4. 7.3.4 Foldback Current Limit
      5. 7.3.5 Undervoltage Lockout (UVLO)
      6. 7.3.6 Thermal Shutdown
      7. 7.3.7 Active Discharge
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Load Transient Response
      4. 8.1.4 Undervoltage Lockout (UVLO) Operation
      5. 8.1.5 Power Dissipation (PD)
        1. 8.1.5.1 Estimating Junction Temperature
        2. 8.1.5.2 Recommended Area for Continuous Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision F (April 2022) to Revision G (May 2022)

  • Changed UVLO condition from rising to falling for YCJ and YCK packages.Go

Changes from Revision E (December 2021) to Revision F (April 2022)

  • Changed DSBGA dimensions from 0.603 mm × 0.603 mm to 0.616 mm × 0.616 mm in Features and Description sectionsGo