SBVS338E March   2020  – December 2021 TPS7A20

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Low Output Noise
      2. 7.3.2 Smart Enable
      3. 7.3.3 Dropout Voltage
      4. 7.3.4 Foldback Current Limit
      5. 7.3.5 Undervoltage Lockout (UVLO)
      6. 7.3.6 Thermal Shutdown
      7. 7.3.7 Active Discharge
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Load Transient Response
      4. 8.1.4 Undervoltage Lockout (UVLO) Operation
      5. 8.1.5 Power Dissipation (PD)
        1. 8.1.5.1 Estimating Junction Temperature
        2. 8.1.5.2 Recommended Area for Continuous Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information

THERMAL METRIC(1) TPS7A20 UNIT
DBV
(SOT-23)
DQN (X2SON) YCJ  (DSBGA) YCK  (DSBGA)
5 PINS 4 PINS 4 PINS 4 PINS
RθJA Junction-to-ambient thermal resistance 187.1 166.1 199.6 201.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 85.5 103.6 2.8 2.8 °C/W
RθJB Junction-to-board thermal resistance 54.4 110.6 67.5 69.3 °C/W
ψJT Junction-to-top characterization parameter 27.1 3.0 1.4 1.4 °C/W
ψJB Junction-to-board characterization parameter 54.1 103.3 67.4 69.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 98.8 N/A N/A °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.